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RDIMMSamsung Electronics, Ltd. (Seoul, Korea) has started mass producing what are believed to be the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. The new high-density, high-performance module is positioned to support the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions. The new RDIMMs:

  • Include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies.
  • Use the company’s most advanced 20-nanometer (nm) class process technology and 3D TSV package technology to manufacture the low-power chips.
  • Perform twice as fast as a module that uses wire bonding packaging, while consuming approximately half the power, according to the company.

For more information, visit www.samsung.com

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