Molex (Lisle, IL) announced its Impel backplane connector system is available for use with the company’s Backplane Pin Map Configurator. This connector solution provides equipment manufacturers with the ability to have systems operate at today’s data-rates and costs, while providing a migration path for enhancements in the same chassis through Impel daughtercard options. The Impel connector system:
- Delivers low cross-talk and high density performance with data-rates up to 40 Gbps for next-generation backplane interconnect solutions.
- Meets all critical architectural needs, including conventional, co-planar, orthogonal midplane and orthogonal direct.
- Is appropriate for telecommunications and data networking applications.
For more information, visit www.molex.com