Local interconnect network (LIN) nodes are witnessing exponential growth rates in cars, resulting in master modules controlling multiple LIN buses. To address this growing need for multi LIN transceiver systems, Melexis (Nashua, NH) introduces a new generation of 2 and 4-channel LIN transceiver IC. The MLX80002/4 can reduce system costs of the LIN physical layer by 20% compared to multiple single transceiver ICs found in, for example, a body control module (BCM). The MLX80002/4 extends Melexis’ existing product line of LIN transceivers and system basis chips. Other features include:
- The ability to combine two or respectively four LIN transceivers on one die.
- 0.35 micron HV-CMOS technology.
- Very low electromagnetic emission to further simplify the design challenges of networked communication in hostile automotive environments.
- Automotive temperature range of -40°C to 125°C.
- On-chip protection against over-temperature, 40V load dump, and LIN short to ground.
For more information on the MLX80002/4, visit www.melexis.com.