Vicor Corporation unveiled the first module utilizing its Converter housed in Package (ChiP) power component platform. This new ChiP bus converter module (BCM) supplies 1.2 kW at 48 V with 98 percent peak efficiency and 1880 W/in3 power density. The module is asserted to offer four-times the density of competing solutions to enable efficient, high voltage DC distribution infrastructure in datacenter, telecom, and industrial applications. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiPs provide desirable thermal management supporting exceptional power density. According to the company, ChiPs enable customers to achieve low cost power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably.
Vicor Corporation, www.vicr.com