Micro-sized, (.050 inch pitch), connectors in compact metal or over-molded polymer shells offer dramatic size and weight reductions for circuits requiring multiple pin interconnection systems. Omnetics offers an extensive array of micro-circular connector styles and formats using its specially designed flex-pin contacts. These configurations are available solder cup, thru-hole and pre-wired up to 26 gauge wiring. Multiple metal shell options provide the designer a variety of locking systems and can also be used to connect cable shielding to a panel mounted connectors on the instrument chassis. Over-molded polymer shells are also available and can be used to reduce overall diameter and weight. A number of mating systems from cable to cable and cable to panel mounts are exhibited in Omnetics' Micro 360 Catalogs and can be seen at http://www.omnetics.com/products/circular-micro_miniature/
Micro-miniature circular connectors employ Omnetics' gold plated Beryllium plated Flex-pins and are available as standard products ranging from 5 to 27 positions per shell. Current rating is set for up to 3 amperes with a dielectric withstand voltage of 660 volts and insulation resistance of 5000 Meg-ohms at 500 volts dc. These Micro-miniature connectors are designed to perform consistently up thru 20 gs of vibration with no discontinuities greater than 1 microsecond and pass 50 gs of shock. Metal shells and plating options include nickel, brass, stainless steel and black oxide finishes. Standard or custom back-shells as well as pre-molded strain-reliefs are designed to fit the size and shape of the cable attached. Beyond the standard circular designs, the designer can specify mixed signal formats to reduce even further size, shape and weight of the interconnection systems as a whole. When combining two connectors into one using two different pin types or pin sizes, inside one insulator/shell, the designer has reduced the number of outer shells and concentrated the signal and power entry area into the instrument. This significantly improves the miniaturization of the equipment involved.