IXYS Corporation announced today a new high-power phase-leg in the SimBus-F outline with a total Current - Voltage capability of 600 Ampere and 650 Volt.
The excellent best-in-class performance of the discrete 650 Volt XPT Trench IGBT products is now also available in module outlines, up to 600 Amperes with the IXYS fast “Sonic” diodes. The XPT IGBT and Sonic diode are specifically designed for parallel operation in high power modules. Their saturation voltage positive temperature coefficient results in an optimal current sharing.
The silicon operation temperature range is increased to receive maximum possible current density. Maximum junction temperature of these devices is 175 degrees C where by constant operation the maximum temperature is specified at 150 degrees C.
Utilizing the IXYS SIMBUS F module outline, the MIXD600PF650TSF features a 17 millimeter height together with an isolated copper baseplate for optimal thermal conditions with market leading reliability.
The MIXD600PF650TSF is designed for high-power control applications such as UPS, battery chargers, inverters, solar inverters, motor drives, electrical vehicles, elevators and other industrial applications. For these applications IXYS offers also the wide range of devices needed for such designs, like the standard rectifier modules, drivers ICs and MCUs. Visit the IXYS website for more information on the World of IXYS solutions and reference designs.
The MIXD600PF650TSF is available in production quantities. For additional information, please contact your local sales representative at: http://www.ixys.com/SalesContacts.aspx or visit http://ixapps.ixys.com/DataSheet/MIXD600PF650TSF.pdf for the datasheet.