TE Connectivity (TE) launched a line of M.2 next-generation form factor (NGFF) connectors, which are designed using the new interface standard for a smaller form factor in both size and volume. Engineered for a wide range of applications, including SSDs (solid state drives) and wireless cards of all types for use in notebooks, ultraportable devices, tablets, desktops and servers, TE’s M.2 (NGFF) products meet both current and future market needs for slim solutions

 TE is at the forefront of evolving markets that need miniaturized connectors to maximize printed circuit board (PCB) real estate, reduce profile height and support higher data rates. They designed two M.2 (NGFF) product types having a standard top PCB mount or a midplane (offset) PCB mount. The M.2 connectors are designed in a dense form factor of just 0.5mm pitch with 67 positions.

TE’s M.2 (NGFF) product portfolio offers industry-leading features and benefits, including:


 · Provides a range of profile heights

· Supports enhanced data rates, which include PCI Express 3.0, SATA 3.0 and USB 3.0

 ·Saves more than 20 percent of PCB real estate

 ·Reduces connector height by 15 percent (as compared to PCI Express Mini Card connectors)

 · Ensures proper mating configurations with module cards through several keying options

 · Accepts both single- and double-sided modules

TE Connectivity