Molex Incorporated announced a new technology that transfers the connectivity and ease of use features from the LED array metal or ceramic substrate to a separate plastic body substrate, allowing for improvements in thermal, optical and mechanical interconnect functionality. This plastic body substrate can be combined with the LED array package in a number of ways to provide an array top side surface with multiple connection choices. This new technology, co-developed with Bridgelux, Inc., has been incorporated into its Vero array product family. The interconnect technology is expected to make future LED array products easier to integrate and more cost effective, enabling lighting OEM’s to reduce system costs, decrease time to market and to improve the reliability of LED luminaires they design. These advances include thermally isolated solder pads, an integral Molex Pico-EZmate header, and improved mechanical attach and optical reference features, all while maintaining a very low profile. The solder pads are designed to make direct soldering easier and more robust than soldering to current array packages made of materials such as aluminum or ceramics. The Pico-EZmate connector header option enables a solder free electrical interface and options for field service and replacement.