Alpha and Omega Semiconductor Limited introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of exceptional power dissipation. The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology, and proprietary exposed ground pad packaging technology. The new platform enables more thermally efficient dc/dc solutions for consumer, networking and industrial applications such as LCD TVs, set-top boxes, cable modems, and power supplies.
The ground exposed die pad platform combines a current-mode step-down controller IC with integrated high-side and low-side MOSFETs. The vertical MOSFET structure features outstanding on-resistance performance which allows more power delivery in a small area, while the exposed ground pad transfers heat directly to the printed circuit board’s ground plane which acts as a large heat sink. Another benefit of the large ground exposed pad is that it reduces electromagnetic interference and noise coupling into the system.
The high-side p-channel MOSFET and low-side n-channel MOSFET with integrated Schottky diode, combined with a bond-wireless packaging technology deliver best-in-class junction temperature performance for a 30W, 12V to 5V post-regulating application.
Alpha and Omega Semiconductor Limited,