Advanced Interconnections Corp –. will feature a broad array of customized connector capabilities at electronica 2012 in Munich from 13-16 November. In addition to the company’s standard SMT and thru-hole board-to-board connectors, application-specific designs will be showcased, ranging from large, shrouded solutions for high-reliability board stacking to micro flex cable-to-board connectors.
Over 30 years of interconnect design experience, combined with a fully integrated manufacturing facility, ensure complete process control from concept through production. Interconnect technology from the Advanced Tool Box will be featured including solutions for blind mating, mixed SMT & Thru-hole board processing environments, non-traditional insulator shapes, and lead-free plating options.
Advanced Interconnections will be co-located with local distributor, RTS connect GmbH, in Stand B4.536. Samples of standard connectors including an extensive line of Peel-A-Way® Removable Carriers, Mezza-pede® Low Profile SMT Connectors, and B2B® SMT Connectors will be available as well as experienced technical support to discuss customized applications.
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