LPKF, a leading manufacturer of laser and electronic systems, will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming  IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium for 2011 (IMS2011), scheduled to take place June 7-9 2011 at the Baltimore Convention Center in Baltimore, Maryland. LPKF’s technologies bring significant new precision and control technology to the production of high-performance RF/microwave circuits.  

The LPKF ProtoLaser S laser system structures complete PCBs in minutes – with a layout area of approximately 229 x 305 x 10 mm (9" x 12" x 0.4") and is unbeatable in speed and precision when working with RF and microwave applications. The significant time savings allows different layouts to be tested quickly and simply. Prototypes and small production batches also can be produced on short notice if required. The system requires no chemicals and is easy to operate.

Alignment of two-sided prototypes increases tremendously with the fiducial recognition camera. The camera allows the LPKF ProtoLaser S to visually inspect and properly align the work piece. For drilling through-holes in PCBs, LPKF ProtoMat is an ideal complement to the LPKF ProtoLaser S.

The LPKF ProtoMat S63 handles virtually any in-house prototyping application with ease and is configured for RF and microwave requirements. Its high-speed capabilities accommodate structures as small as 100 µm. The all-around system masters 2.5-dimensional material machining and features a faster spindle speed of 60,000 rpm. This feature also makes it suitable for drilling test adapters and housing production.

The ProtoMat S63 features automatic tool change, in which up to 15 tools are changed automatically during production. This reduces setup times and allows for unattended production. Additional features include automatic milling width adjustment and solder paste dispensing. The system also is upgradeable to the ProtoMat S103.

With LPKF’s Laser Direct Structuring process (LDS™), circuit layouts can be produced on complex 3-D carrier structures. The laser beam structures the layout directly into the molded plastic part, reducing weight and fitting space. Features of LPKF’s LDS™ include through-hole capability, compliance with SMT requirements, and fine and finest resolution.

Representatives also will have literature available for LPKF’s MicroLine Series for UV laser depaneling and StencilLasers G 6080 and P 6060. For more information, stop by Booth #2202 during IMS Baltimore 2011 or visit