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optically clear flexible epoxyMaster Bond developed Polymer System EP37-3FLF. This optically clear, two component epoxy has resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a desirable potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. Its properties allow it to cure without stressing delicate electronic components. Serviceable over the wide range of 4K to 250°F, EP37-3FLF cures at room temperature in two to three days or faster at elevated temperatures. This epoxy offers a non-critical 1 to 1 mix ratio by weight or volume, and a low mixed viscosity of 1,400 cps to 1,500 cps. Users can work with a 100-g mass of the adhesive at room temperature for up to 90 minutes. The bond shear strength exceeds 2,000 psi, and the T-peel strength is 25 pli. This epoxy has an elongation of 180 percent and desirable electrical insulation properties with a volume resistivity of 1x1014 ohm-cm.

Master Bond
201-343-8983, www.masterbond.com
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