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sensing dieAll Sensors Corporation introduced a low pressure sensor die for high volume applications requiring pressure measurement to as low as a quarter inch of water full scale. The MEMS Piezoresistive Low Pressure Sensing Die uses an open bridge configuration, measuring 2 mm x 2 mm square. Desirable sensitivity specifications are made possible by a new process technology in combination with exceptional MEMS topology. The new die design features maximum pressure response while maintaining low package stress susceptibility. By using a boss-less structure the position sensitivity is minimized (typically 0.1 percent inH2O/g).

All Sensors Corporation
408-225-4314, www.allsensors.com 
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