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compact rugged RISC compSealevel’s Relio R9 is an application-ready platform for embedded applications requiring small size, wide operating temperature range, and flexible I/O connectivity. The I/O features of the Relio R9 are said to extend the possible uses beyond traditional ARM applications. Windows CE 6.0 BSP and low-level drivers for system I/O are included. Features include a compact, rugged package for durability, up to 256 MB RAM and 256 MB Flash memory, and serial, digital and analog I/O. For applications with specialized hardware requirements, the Relio R9 can be used for development while a customized target system is designed for the user’s specific requirements.

Sealevel Systems
864-843-4343, www.sealevel.com 
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