TDK Corporation has announced that it has developed soft termination MLCC capacitors that offer improved thermal and mechanical robustness. To address reliability issues with the C1005 (CC0402) through C3225 (CC1210) case sizes, TDK has developed a four-layer termination structure that exhibits increased durability to thermal and mechanical stresses when compared to traditional MLCC products, according to the company. This newly developed product adds a conductive resin layer between the copper base material and the nickel plating layer. While the 100 percent matte Sn termination finish is compatible with Pb solder systems, the soft termination MLCCs features are most significant when used with Pb-free solder. Temperature cycling performance of the soft-termination construction is three times that of the standard product. Mechanically, as well, the soft termination construction exhibits improved performance with Pb-free solder applications. This new MLCC series withstands much greater board bend stress with no change in capacitance and an open-mode failure condition when compared to traditional MLCCs, the company asserts.