Using a custom heat sink enabling operation to 100W, the XG-LGA-7000 socket for 0.65 mm pitch LGA devices is designed for a 12 mm package size. With 50? per pin contact resistance and a current capacity of 5 amps per pin, the socket operates at bandwidths up to 40 GHz with less than 1dB of insertion loss and has a pin self-inductance of 0.11 nH, a mutual inductance of 0.028 nH, and capacitance to ground of 0.028 pF. Features include a low inductance elastomer with a gold plated, barbed pad connecting to the IC Pad that can withstand temperatures from -40°C to +155°C, and an open-lid option to allow probing of die or direct injection of heat or cooling air. From $1397 each.