Molex Incorporated introduced its 170-circuit AdvancedMC connector solution for 12.5 Gbps NRZ signal transmission. The connectors support PIGMG AdvancedTCA industry specifications for next-generation mezzanine cards and are well-suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA applications. They feature controlled impedance and reduced crosstalk, plus a footprint launch optimized for high-speed data rates. This enhanced footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground vias for isolation. As a result, the connectors achieve a crosstalk of less than 3 percent at 12.5 Gbps and deliver superior signal integrity compared to competitive brands. The connectors are made with an insert-molded wafer press-fit design that uses very simple tooling and permits easy connector-to-PCB mounting. Featuring tin or tin-lead tail plating options, Molex AMC.0 B+ connectors support RoHS requirements and are available in three versions: standard, pegless and extended height.
Product URL: http://www.molex.com/product/amc0.html.