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ec79tm804a-LOptoTherm, Inc. announces another version of its Micro thermal imaging system that includes a thermal imaging camera with greater sensitivity, 16-bit digital camera link interface, and a microscopic lens with 20 µm spatial resolution. It is used to detect shorts and defects on semiconductor devices and small circuit boards, and it can also measure junction temperature, identify die bonding defects and measure packaged die thermal resistance. The optical mounting table provides a sturdy platform with vibration isolation on which to perform sensitive testing. Precise camera focusing and positioning is accomplished using the vertical focus stage. Areas of interest on a device can be positioned within the camera’s field-of-view using the XY stage.
OptoTherm, Inc.
724-940-7600, www.optotherm.com
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