Heat Sinks & Dissipators

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Cost-effective cooling for high-power LED lighting

A new series of 100W-200W stamped heatsinks from Glaciallight is designed for flood lights and other high-wattage LED lighting applications. Three wattage ratings are offered - 100W, 150W and 200W and heat pipes are available to help dissipate heat from high power CoB LEDs....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Thermal controller designed to operate with thermoelectric modules

Oven Industries’ (Mechanicsburg, PA) Model 5R7-350/347 is an economical thermal controller especially designed to operate with thermoelectric (Peltier effect) modules. Most of these modules may be operated in either a cooling mode or a heating mode depending on current direction....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Dimensionally stable two component urethane modified epoxy gel is thermally conductive

Primarily used for potting and encapsulation applications, Master Bond Super Gel 9AO is a soft, urethane modified gel-like epoxy that offers thermal conductivity and electrical insulation properties. This two part system is also employed for

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Personal air-conditioning vest re-designed for better comfort and cooling

ITW Vortec today launched its re-designed and re-engineered Personal Air Conditioning (PAC) vest. The Vortec PAC vest, already praised as an innovative solution to protect industrial workers in extreme temperature environments, now offers even more features to ensure comfort and cooling.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

New option for thermoelectrically cooled electronic enclosures makes washdowns fast and easy

EIC Solutions has announced the new M74 clean out modification option which facilitates washdown of thermoelectric coolers mounted to electronic enclosures. The M74 option was application-driven arising from suggestions received from customers in food processing, and other process industries requiring frequent rinsing or washing of equipment.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Metal

Epoxy mount socket operates at bandwidths up to 8 GHz

Ironwood Electronics has recently introduced a new high-performance BGA socket for 0.8mm pitch BGA 78 pin DDR3 packages. The SG-BGA-6374 socket is designed for an 9x13 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Ethernet/Internet

Dispensable thermal pads tout desirable performance for LED lamps, luminaires

Dow Corning introduced new Dispensable Thermal Pads, which are positioned as providing cost-effective thermal management in LED lighting applications. The new materials are said to enable LED lamp and luminaire manufacturers t

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

Thermal imaging test kits designed for research, development, and machine vision applications

FLIR Systems introduces its new FLIR A5sc, A15sc, and A35sc longwave infrared thermal imaging camera kits. Designed specifically for thermal bench top testing applications and easy deployment in tight machine vision locations, AX5sc cameras are available in a variety of pixel resolutions from 80×64 and 160×128 up to 320×256....

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates | Temperature

Thermal interface material designed to transfer heat to heat sink

Fujipoly announces the availability of Sarcon50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces.

LISTED UNDER: Heat Pips Thermal Gap Pads Materials and Substrates

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