GR-Tac is a very economical thermal interface solution and is suited for both low and high-volume production runs. When placed between a heat source such as a high-performance semiconductor and a nearby heat sink, this Sarcon TIM will transfer heat with a thermal conductivity of 1.5 W/m°K and a thermal resistance as low as .33 °Cin2/W. Due to its reinforced polyester mesh construction, this gap filler pad is the perfect choice for most die-cut installations. It is available in sheets up to 300 x 200mm.
For more information, call (732) 969-0100 or visit them on the Web at http://www.fujipoly.com .