Aries Electronics expanded its line of BGA Switch-A-Pitch Adapters that simplify high density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards. The series now includes models with tops where the BGA landing pads are on a 0.40 mm pitch and adapter bottoms are populated with BGA balls on a 1.27 mm pitch. Designers can use readily-available, and therefore less expensive, larger pitch boards because the adapters allow new, tighter pitch devices to be placed on existing larger pitch designs. In addition, the adapter tops leave open space around the location for a replacement device. According to the company, the Switch-A-Pitch design eliminates the need for laser-drilled microvias on motherboards. Standard line and trace spacing down to 0.003" (0.75 mm) can be used.
215-781-9956, www.arieselec.com