Combining on-chip Extended-Depth-of-Field (EDoF) with ST’s 1.75 µm pixel process, STMicroelectronics’ VD6853 and VD6803 3.15-megapixel CMOS image sensors enable image quality at focus distances down to 15 cm in phone cameras. The components embed 4-channel anti-vignette, and come in a TSV (Through Silicon Via) wafer-level package or as a COB (Chip On Board) die. The units are available with a 10-bit parallel legacy interface (VD6803) or CCP2 interface (VD6853), and are compatible with most baseband and application processors with integrated Image Signal Processor. The raw Bayer sensors can perform in laptop cameras, toys, or machine-vision applications. Pricing is <$5.
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