With a life cycle of 3,000 operations, ITT Interconnect Solutions' Universal Contact stamped contact uses pre-loading and anti-lift designs and comes with dome contact points and “side wings”. Addressing solderless component interconnection applications, the small-form-factor device has a contact height range from 1.3 to 4.0 mm and compressed heights as low as 0.9 mm. The WEEE- and RoHS-compliant contact is appropriate for PC card products, home electronic devices, medical products, automotive telematic systems, as well as handset and wireless handheld devices.
ITT Interconnect Solutions
714-628-8370, www.ittcannon.com