Ironwood Electronics recently introduced a high performance BGA socket for 0.8 mm pitch SDRAM. The SG-BGA-6252 socket is designed for a 9 mm × 11 mm, 0.8 mm pitch 60-pin BGA package and SG-BGA-6253 socket is designed for a 9 mm × 13 mm, 0.8 mm pitch 84-pin BGA package. The sockets operate at bandwidths up to 8 GHz with <1 dB of insertion loss. The sockets are designed to dissipate up to several Watts without extra heat sinking and can dissipate more Watts with custom heat sink. The contact resistance is typically 25 m per contact. The sockets are ZIF sockets and provide desirable signal integrity. The interconnects are constructed with high performance and low inductance elastomer. The temperature range is -35°C to +100°C. The pin inductance is 0.28 nH. The SG-BGA-6252 socket accommodates IC packages such as the 60-pin Samsung DDR2 SDRAM (K4T51043QE) FBGA package. The SG-BGA-6253 socket accommodates IC packages such as the 84 pin Samsung DDR2 SDRAM (K4T51043QE) FBGA package. The sockets are mechanically mounted to target PCB. Pricing is $348 each.
800-404-0204, www.ironwoodelectronics.com