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Home > High Speed, High Density Backplane Connector System Offers Two Compliant Pin Design Options

High Speed, High Density Backplane Connector System Offers Two Compliant Pin Design Options

Molex Incorporated’s Impact backplane connector system is designed to meet the next generation requirements of telecommunications and data networking equipment.Molex Incorporated’s Impact backplane connector system is designed to meet the next generation requirements of telecommunications and data networking equipment. They provide up to 80 differential pairs per linear inch in less than 2 mm total width. The system offers two compliant pin design options so customers can balance their electrical and mechanical application needs. Additional features include; broad-edge coupled, hybrid shielding design, providing low cross-talk, insertion loss and minimal performance variation across all high speed channels. A 1.90 mm x 1.35 mm grid on both backplane and daughtercard, reducing PCB routing complexity and supplying adequate spacing for high speed routing; a daughtercard mating interface providing inline staggered, bifurcated contacts with two points of contact for long-term reliability and built-in ground-signal sequencing. Two compliant pin options properly balance the mechanical and electrical performance of the system; and IEEE 10G BASE-KR and OIF State Eye Channel compliance. Impact is available now in 3-, 4-, 5- and 6-pair versions, with a complete range of guidance and power-solution options.  Prices start at 20 to 32 cents per mated differential channel and require approximately an 8-week lead time. 

Molex Incorporated
800-786-6539, www.molex.com [1] 

For more information, visit: http://www.molex.com/link/Impact.html [2]

Content Item Type: 
Product Announcement [3]
Meta Canonical URL: 
http://www.ecnmag.com/product-releases/2008/02/high-speed-high-density-backplane-connector-system-offers-two-compliant-pin-design-options
Summary: 
Molex Incorporated’s Impact backplane connector system is designed to meet the next generation requirements of telecommunications and data networking equipment. They provide up to 80 differential pairs per linear inch in less than 2 mm total width. The system offers two compliant pin design options so customers can balance their electrical and mechanical application needs. Additional features include; broad-edge coupled, hybrid shielding design, providing low cross-talk
Meta Keywords: 
Impact backplane connector, mm total width, compliant pin design, data networking equipment, compliant pin options, hybrid shielding design, mechanical application needs, IEEE 10G BASE-KR, high speed, daughtercard mating interface, high speed channels, built-in ground-signal sequencing, 8-week lead time, State Eye Channel, power-solution options.  Prices, mm grid, Molex Incorporated, differential pairs, adequate spacing, generation requirements, insertion loss, linear inch, minimal performance, differential channel, Additional features, long-term reliability, electrical performance, 6-pair versions, complete range, cents, variation, PCB, complexity, telecommunications, inline, customers, contacts, points, contact, www.molex.com, information, http://www.molex.com/link/Impact.html
Meta Description: 
Molex Incorporated’s Impact backplane connector system is designed to meet the next generation requirements of telecommunications and data networking equipment. They provide up to 80 differential pairs per linear inch in less than 2 mm total width. The system offers two compliant pin design options so customers can balance their electrical and mechanical application needs. Additional features include; broad-edge coupled, hybrid shielding design, providing low cross-talk
Product/Service Categories: 
Packaging & Interconnects [4]
Legacy NID: 
79 827

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Source URL: https://www.ecnmag.com/product-releases/2008/02/high-speed-high-density-backplane-connector-system-offers-two-compliant-pin-design-options

Links
[1] http://www.molex.com/
[2] http://www.molex.com/link/Impact.html
[3] https://www.ecnmag.com/content-item-types/product-announcement
[4] https://www.ecnmag.com/product-categories/packaging-interconnects