Fairchild Semiconductor introduces ten highly efficient, integrated Motion-SPM power modules for home appliances and industrial motors up to the 3 kW power range. Integrating fully tested components––three HVICs, one LVIC, six NPT IGBTs, six FRDs and three bootstrap diodes––into a compact 44 mm × 26.8 mm Mini-DIP package, these modules offer desirable inverter-based control for energy-efficient three-phase motors. Replacing as many as 22 discrete components, these products are aid in reducing board space, decreasing manufacturing costs, speeding time-to-market and increasing system reliability. These highly integrated devices utilize full molded or Direct Bonded Copper (DBC)-based package technology. The product’s DBC-based Mini-DIP package provides extremely low thermal resistance (FSBB30CH60B (600V/30A): Rt IGBT = 1.17°C/W). They utilize lead-free (Pb-free) terminals and have been characterized for moisture sensitivity in accordance with the Pb-free reflow requirements of the joint IPC/JEDEC standard J-STD-020.
207-775-8100, www.fairchildsemi.com