Mill-Max introduces its family of SPDIP mating pin headers to compliment its line of SPDIP sockets. SPDIP (shrink plastic) packaging reduces device lead spacing between pins down to .070" pitch (1.778 mm) which is useful in memory, microcontrollers, video controllers and automotive design applications. DIP and SIP headers are also used in interconnect applications such as board stacking, socket testing and elevating circuits off the board surface. These headers are precision-machined, using brass alloy 360, and they are configured with pluggable tails.
Mill-Max Mfg. Corp.
516-922-6000, www.mill-max.com