Endicott Interconnect Technologies’ HyperBGA PTFE-based coreless semiconductor package enables silicon devices to run at high speeds. The combination of the low loss, low dielectric constant material and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane, enables the package to provide long field life with none of the BGA wear out, die cracking, delamination or flip chip bump fatigue of other packages. The product line has applications in the networking, high end server, telecommunications, aerospace, military and medical industries where speed, reliability and increased signal I/O, along with reduced weight, height and overall package size (SWoP), are critical.
Endicott Interconnect Technologies
866-820-4820, www.eitny.com