Murata Manufacturing Co., Ltd. has extended its lineup of the world's smallest (0.4 x 0.2 mm) Hi-Q type*1 monolithic ceramic capacitors from the hitherto maximum value of 10 pF (Picofarads) to 22 pF, and has recently commenced production of the new capacitors in the lineup. The realization of 22 pF in this size is a world first.
While the number of mounted components is increasing along with greater sophistication of compact mobile equipment such as smartphones, greater miniaturization of the mounting area is being demanded. There are also strong demands for miniaturization of Hi-Q type monolithic ceramic capacitors, which are employed in high-frequency modules such as power amplifiers.
Previously, the smallest Hi-Q type capacitor was 0603 size (0.6 x 0.3 mm) , however in September 2011 Murata commercialized the world's first 0402 size Hi-Q type capacitor (GJM02 series) . We have newly added a range of capacitors from 11 pF to 22 pF to the current lineup of 0.2 pF to 10 pF.
Regarding mounting, the previously used paper taping caused problems such as the obstruction of improved cleanliness during the mounting process by fluff and paper particles from the taping backing paper, product pickup failures due to static electricity, and ESD*2 destruction of memory modules, for example. For this reason, a new packaging form for ultra-miniature components was demanded. As a result, this series of capacitors employs new packaging form W4P1*3 taping.
The GJM02 series features reduced mounting area, reduced equipment profile, Hi-Q, and low ESR*4, contributing to reduced power consumption. It also employs new packaging form W4P1 taping, contributing to greater production process yield.
- Downsizing from 0603-size Hi-Q-type MLCC (GJM033) possible.
- Optimal for the coupling*5 application for high-frequency operation.
- Hi-Q and low ESR at frequency bands including VHF, UHF, and microwave frequency range.
- The capacitance range is increased, contributing to design optimization.
The use of the new packaging form W4P1 taping contributes to the following:
- A clean mounting process
- Prevention of faults due to static electricity
- Reduction of waste packaging materials
- Reduction of component transportation and storage costs
Power amplifiers and high-frequency module applications
Representative example: For CH characteristics, 22 pF, J deviation (±5%) : GJM0222C1C220JB01
|Temperature characteristics:||CH (0±60 ppm/°C or C0G (0±30 ppm/°C) Capacitance 11 pF – 22 pF|
|Operating temperature range:||-55°C-+125°C|
|0402 size:||L=0.4±0.02, W=0.2±0.02, T=0.2±0.02 (Unit: mm)|
Mass-produced since May 2012.
|*1 Hi-Q:||As a result of reviewing the materials used, it was confirmed that the GJM02 series has a higher Q value* in the VHF, UHF, and microwave frequency ranges compared with standard monolithic ceramic capacitors (GRM series) .
|*2 ESD:||Abbreviation of "electrostatic discharge." Refers to an electrostatic discharge, or destruction of a device due to an electrostatic discharge.|
|*3 W4P1:||4mm-wide embossed tape (plastic tape) with 1mm component mounting pitch.|
|*4 ESR:||Equivalent Series Resistance|
|*5 Coupling:||Function for shutting down DC signals and allowing only AC signals to pass.|