SiP Global Summit is the one of the most prestigious international events focusing on advanced packaging and testing technology development. SiP Global Summit operates under the auspices of the SEMI Taiwan packaging and testing committee which includes representatives from Amkor, ASE, ChipMos, Global Unichip, Mediatek, Nanya, SPIL, TSMC and more. The event is also supported by international research organizations: IEEE Components, Packaging, and Manufacturing Technology Society (CPMT), Industrial Technology Research Institute (ITRI), I-Shou University, and Fraunhofer.
According to Yole Développement, the market value of all the devices using TSV packaged in 3D in the 3D-IC or 3D-WLCSP platforms (CMOS image sensors, Ambient light sensors, Power Amplifiers, RF and inertial MEMS) reached $2.7 billion in 2011. By 2017, the market value will hit $40 billion, representing 9 percent of the total semiconductor value.
“3D-IC provides another path towards “More than Moore” as conventional CMOS scaling becomes more and more challenging. With relatively smaller capital investments, 3D integration has been strategic innovation for the industry despite the economic downturns,” said Mr. Terry Tsao, president of SEMI Taiwan. “However, information sharing and communication across the supply chain are pre-requisites for 3D-IC adoption. SEMI provides an information platform to help Taiwan manufacturers develop a better understanding of 3D-IC readiness and achieve further successes in advances.”
Technology Forum: 3D-IC Supply Chain Readiness
Through Silicon Via (TSV) as interconnect in 2.5D and 3D-IC new packaging applications are hot topics at semiconductor conferences. Most industry leaders who are currently involved in 3D development believe that the realization of 3D-IC technology into high-volume manufacturing is simply a question of “when?” Industrial readiness and infrastructure maturity will be examined at the SiP Global Summit. Representatives from manufacturing supply chains, ranging from EDA to foundry/OSAT, will share their views through interactive discussion in an open panel.
Dr. Ho Ming Tong, general manager and chief R&D officer of ASE Group, will deliver opening remarks and a presentation on September 6 to kick off the two-day conference. TSMC’s perspective and roadmap on 3D-ICs will be another highlight of the forum. Featured speakers from Amkor, Aptina, Cadence, EVG, LSI, Teradyne, Tohoku-MicroTec, UMC and Xilinx will share their insights into 2.5D and 3D-ICs technology. Market integration, technology trends, R&D, materials supplies, production nodes, tool readiness, commercialization and product standardization will also be discussed at the forum.
Embedded Technology Forum
In the Embedded Technology Forum on September 7, embedded integrated passive devices on substrates, embedded IC chips in substrates, and embedded fan-out wafer-level packaging (both 2D and 3D) will be presented and discussed. Dr. Klaus-Dieter Lang, director of IZM at Fraunhofer, Mr. Thorsten Meyer, principal engineer at Intel Mobile Communications, Mr. Yonggang Jin, engineering manager at STMicroelectronics, Mr. Yoon Seung Wook, deputy director at STATSChipPAC, and Mr. Satoshi Okude, group manager at Fujikura Ltd., will speak on embedded substrate development trends from a technology, market and application perspective.
For detailed speaker information, visit www.sipglobalsummit.org.
on SEMICON Taiwan 2012 show and conference information, visit www.semicontaiwan.org/en/.
SEMI is the global industry association serving the micro- and nanoelectronics manufacturing supply chains. Over 2,000 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
Tel: 886.3.560.1777 ext.201
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