IPC/JEDEC J-STD-033C provides surface mount device (SMD) manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. Use of the standard helps achieve safe and damage-free reflow with the dry-packing process and provides a minimum shelf life of 12 months from the seal date when using sealed dry bags.
In addition to its expanded scope, the C revision contains a correction made to the desiccant calculation and an allowance for less use of desiccant for MSL2 parts, if desired.
To help users understand the importance of moisture-barrier bags (MBBs) for maintaining the shelf life of packaged ICs and non-ICs, J-STD-033C includes diagrams of recommended, not recommended and acceptable MBB air evacuation.