Kyzen’s extensive line of cleaning technologies has been developed according to the increasing demand for advanced cleaning chemistries. New electronic devices and assemblies provide better yields and lower failure rates after cleaning, and after many years of extensive R&D efforts, Kyzen is now meeting this demand to supply a suitable cleaning product at any point in the manufacturing process where cleaning is necessary.
Kyzen’s cleaning chemistries not only have been proven to perform wherever they are used, but also are award-winning products that are eco-friendly, cost-effective and easy-to-use. The company continually tests its products against the latest soils in every aspect of manufacturing and strives to continually improve products to address current and future cleaning issues such as white residue, more densely populated boards and environmental concerns and restrictions.
Additionally, Kyzen’s chemistries are designed for enhanced cleaning of misprint solder paste, dispensing flux and uncured adhesives. Application-specific formulas are available for under-stencil automated wipes, ultrasonic and spray cleaning. As an additional benefit, B-side SMT misprint cleaning processes now are effectively cleaned using these robust formulas.