Advertisement

Shanghai, China -- June 8, 2011 -- To meet the increasing market demand for hybrid I/O connectors, TE Connectivity (TE) has introduced a 0.6 mm CL (centerline) high-speed CHAMP docking series connector.

The docking series connector is designed for high-density, low-profile (3.8 mm) shield applications and features two rows of contacts on a 0.6 mm pitch CL. Contacts on a 0.6 mm CL can save 30% linear board space and the 3.8 mm low-profile housing reduces connector height by approximately 25%. Multiple options are available including right-angle receptacles, right-angle offset receptacles, and vertical plugs for both dock and cable applications.

TE's 0.6mm CL high speed CHAMP docking series connector is designed to meet various industry transmission standards including USB 3.0, HDMI (high definition multimedia interface) 1.4 and DisplayPort 1.2.

The product can be applied in such industries as PC (including laptops and tablets) and mobile devices.

For more information on TE's 0.6 mm CL high speed CHAMP docking series connector, please visit http://www.tycoelectronics.com/products/pcdocking.

SOURCE

Advertisement
Advertisement