The first production system was delivered in March 2011 to a major semiconductor foundry, which cited throughput and flexibility as benefits of the system. A second system shipped to a leading IDM, where it will be used to develop new packaging processes.
The WS 3880 provides 3D (height) and 2D measurement and inspection of micro and standard bumps, through silicon via (TSV) post-via-fill copper protrusions (nails) and re-distribution layers (RDL) used in 3D IC packaging. It also offers an ultra-high resolution 3D sensor designed for micro bumps as small as a few microns. The WS 3880 inspects flip chip and non-flip-chip wafers. According to Reza Asgari, Rudolph Wafer Scanner product manager, "Micro bumps, TSVs and RDLs are critical interconnect technologies used in 3D IC packages; the new WS 3880 provides the 2D and 3D measurement and inspection capability required to develop and maximize yields for these packaging processes. Ultra-high resolution allows the Wafer Scanner to accurately characterize small features, such as micro bumps and TSV nails...while still preserving the flexibility to handle standard bumps and other larger features."
Rudolph's proprietary 3D laser triangulation technology measures bump height and coplanarity, RDL thickness, and more.
The WS 3880 suits high-volume manufacturing, for either randomly sampled inspection or 100% inspection. The system permits on-line or off-line defect review and classification. Electronic wafer maps can be imported into the system, updated after inspection and exported.
The WS 3880 replaces the 3840 system, launched immediately following Rudolph’s acquisition of RVSI assets in 2008. Over 20 WS 3840 systems have been installed in advanced packaging facilities.
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers. Additional information can be found at www.rudolphtech.com