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SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch, deposition, and thermal processing equipment for the micro-device and semiconductor industry today announced, that it had won a multi-system order for its Sigma PVD, Omega Etch and Delta CVD wafer processing systems from a leading outsourced semiconductor assembly and test (OSAT) provider in the Asia-Pacific region. The systems will be used to create through silicon via (TSV) structures for 3D-IC packaging and marks a new penetration for SPTS.  This win affirms SPTS’s position as one of the leading solution providers to the packaging market with a customer list that includes many of the top 10 OSAT companies such as STATS ChipPAC (http://www.spp-pts.com/index.asp?m=185&month=6&year=2010&c=1206) and SPIL.

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