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SPP Process Technology Systems (SPTS), a leading manufacturer of plasma etch, deposition, and thermal processing equipment for the semiconductor industry today announced it has received a follow on purchase order from CEA-Leti for its Sigma® fxPTM Physical Vapor Deposition (PVD) system. The 300mm system will be used for advanced Through-Silicon-Via (TSV) development at Leti’s newly-inaugurated 300mm fab extension in Grenoble, France. This system win comes on the heels of an October 2010 agreement between Leti and SPTS to collaborate on creating next-generation high aspect ratio TSVs.  The new Sigma system will join SPTS’ silicon etch and dielectric deposition systems previously selected for this new line.

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