ARM and IBM have announced they will collaboratively develop design platforms aligning their manufacturing process, microprocessor and physical IP design teams. This collaboration will minimize the risk and barriers to migrating to smaller geometries while enabling optimized density, performance, power and yield in advanced SoC designs; accelerating the introduction of advanced electronics into the marketplace.
“ARM’s Cortex processors have become the leadership platform for the majority of smart phones and many other emerging mobile devices,” said Michael Cadigan, General Manager of IBM Microelectronics. “We plan to continue working closely with ARM and our foundry customers to speed the momentum of ARM technology by delivering highly advanced, low-power semiconductor technology for a variety of new communications and computing devices”
“IBM has a proven track record of delivering the core research and development that is relied upon by major semiconductor vendors worldwide for their advanced semiconductor devices. Their leadership of the ISDA alliance, which features a diverse set of top-tier companies as members, is growing in importance as consolidation trends in the semiconductor manufacturing industry continue” said Simon Segars, General Manager of ARM’s physical IP division. “This agreement will ensure we are able to deliver highly tuned ARM Artisan Physical IP solutions on advanced ISDA process technologies to meet the early time-to-market our customers demand.”