Mercury Computer Systems announced improved radar subsystem performance through a general purpose Graphics Processing Unit (GPGPU) product based on the NVIDIA “Fermi” architecture, and a 10 Gigabit Ethernet (10GE) standards-based real time sensor interface module. These products enable
Microchip Technology Inc. announced the MCP16301 — it’s first 30-V-input, buck switching regulator with 600 mA output capability. The MCP16301 features a wide input voltage range, from 4 V to 30 V, an output voltage range from 2 V to 15 V and provides
Pulse Electronics introduced its new adaptive antenna concept. This smart antenna can be adapted for integration into devices that use an expanding spectrum of operating frequencies and enables
Analog Devices Inc. (ADI) introduced four high-speed data converter products that support signal sampling rates necessary to accommodate multi-carrier radio platform requirements
More than 150 exhibitors will showcase the newest technologies for sensors and sensors-related industries at the 2011 Sensors Expo & Conference, June 7-8 at the Donald E. Stephens Convention Center in Rosemont, IL. The following is a sampling of the state-of-the-art measurement and monitoring devices for MEMS, Energy Harvesting, Mobile Sensing, Wireless Sensor Networking and more that will be on display Tuesday, June 7 from 10 a.m. – 5 p.m. and Wednesday, June 8 from 10 a.m. – 3 p.m.
Agilent Technologies Inc. (NYSE: A) will demonstrate its newest design and test products for advanced RF and microwave research, development and manufacturing at the 2011 IEEE MTT-S International Microwave Symposium (IMS), June 7-9, at the Baltimore Convention Center.
C&K Components expanded its KMT Series of ultra-miniature tactile switches to include a double-action, double-tactile version. Featuring a low profile, the double-momentary action KMT 6 Series provides
Ericsson Power Modules' 3E Series BMR464 is a new addition to the company's second-generation, digital point-of-load (POL) regulators, that extends the maximum output current from such devices up to 40 A. With desirable functionality, the regulator enables
Skyworks Solutions introduced three wideband quadrature modulators for cellular infrastructure and high performance radio link applications. Designed to support the world's leading 3G and 4G base station providers, the
Antenna Factor introduced its OC Series 1/2-wave dipole antenna, which is asserted to deliver higher gain than a standard whip antenna, increasing the range and reliability of wireless links. Using loaded coil technology, the antenna
Peregrine Semiconductor announced availability of the RoHS-compliant PE42551 50-Ohm RF Switch for high-performance broadband RF applications such as automated test equipment (ATE), related test and measurement applications, and
Radicom Research announced the release of its WiFiHU Series of USB WiFi modem modules. Using these modules, WiFi connectivity can be added to virtually any processor-based device. They support
Dontech, Inc. has developed IMO-bond, a proprietary process of applying rigid optical filters (e.g., contrast enhancing, EMI/RFI shielding, or Therma Klear transparent heaters) to electronic displays via a refractive index matched optical (IMO) bonding process. IMO-bond includes
Scintera Networks announced the availability of the SC1869 and SC1889 second generation system-on-chip (SoC) adaptive RF Power Amplifier Linearizers (RFPAL) to address 3G and 4G heterogeneous network deployments. The SC1869/89 are said to
The W3H0830F hybrid coupler is designed for broad bandwidth applications from 800 to 3000MHz. This LTCC coupler is surface mountable and handles up to 100W of RF power yet has a
Representatives from Rogers Corporation’s Advanced Circuit Materials Division (ACMD) will be on hand at the upcoming 2011 IEEE International Microwave Symposium (IMS) to share insights on the optimum use of the company’s high-performance circuit materials, including its RT/duroid 6035HTC, and RO4360, laminates.
TriQuint Semiconductor and Agilent Technologies Inc. announced results for building next-generation RF solutions. This includes enhanced TriQuint process design kits with support for Agilent’s Advanced Design System 2011 EDA software and the development of an ADS RF Module PDK for TriQuint’s RFIC/MMIC and RF Module integrated design flow. The upgraded
Many have asked the question, “How can we fill the need for rural broadband Internet access in our rural community?” But few have actually ventured beyond the question to attempt to make it happen.
Hittite Microwave announces the release of a new ultra-low phase noise synthesizer IC. The HMC704LP4E has been designed for best phase noise and lowest spurious content possible in an integrated synthesizer.
The R&S ZNB and R&S ZNC from Rohde & Schwarz inaugurate a new generation of vector network analyzers, with a dynamic range up to 140 dB and a sweep time of 4 ms with 401 points and excellent stability.
Stantum, a leading developer of multi-touch technology, announced today that its patented Interpolated Voltage Sensing Matrix (IVSM) technology now supports Google's Android operating system.
TriQuint Semiconductor and Agilent Technologies announced results on their collaboration for building next-generation RF solutions. This includes enhanced TriQuint process design kits with support for Agilent’s Advanced Design System 2011 EDA software and the development of an ADS RF Module PDK for TriQuint’s RFIC/MMIC and RF Module integrated design flow.
Teseq has introduced the new ITS 6006 (Immunity Test System) for radiated EMC emissions testing over an extended 80 MHz to 6 GHz frequency range in a wide variety of EMC applications.
M Series keypads from EAO Switch provide security and access control in public and harsh environments, including heavy-duty and specialty vehicle applications, public kiosks, and vending machines. The M Series modular design and rugged construction make it an ideal solution for fast configuration and customization in any outdoor application.
The new 1.4-micron backside illumination pixel in the OmniVision OV5690 image sensor allows for a full five megapixels in a ¼-inch optical format, and combines best-in-class image quality with a 20 percent reduction in camera module height.