Ultra low power (ULP) RF specialist Nordic Semiconductor announced that Dayton Industrial has announced what the world's first production-ready Bluetooth low energy heart-rate chest belt that is ready to go into volume production.
Qualcomm Atheros announced the AR9004TB, the industry’s first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.4 GHz and 5 GHz band Wi-Fi.
Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with a single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices
The AMA Association for Sensor Technology presents this year’s 10,000-euro SENSOR Innovation Award on the 7th of June equally to two contenders...
The new BU21023/BU21024 Series of high-speed, high noise immunity, low-voltage resistive touchscreen controllers are now available from ROHM Semiconductor. These new controllers are
Skyworks Solutions introduced the first in a series of ultra low current, general purpose low noise amplifiers (LNAs) for diverse wireless applications including Bluetooth headsets, hearing aids, meter reading devices, and 2.4 GHz wireless applications.
LPKF, a leading manufacturer of laser and electronic systems, will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium
Cree Demonstrates Industry's First C-Band GaN HEMT MMIC High-Power Amplifier for Satellite CommunicationsJune 7, 2011 3:31 pm | Product Releases | Comments
Cree will demonstrate the industry's first GaN HEMT MMIC high power amplifier (HPA) for satellite communication applications during the 2011 IEEE International Microwave Symposium held June 7-9 in Baltimore
Agilent Technologies introduced the newest member of its popular ENA Series of network analyzers, the E5072A vector network analyzer.
The Vectron MD-023 EHXO is specifically designed to ensure accurate timing in wireless base stations, and will be showcased in Booth 1002 at the IMS 2011 Symposium in Baltimore, MD from June 7-9th 2011.
The IEEE Symposium on New Frontiers in Dynamic Spectrum Access Networks (DySPAN 2011), the leading international conference dedicated to the advance of cutting-edge wireless technologies, recently celebrated its 5th annual event in Aachen, Germany.
Libelium, a technology leader in wireless sensor networks, announces the launch of Libelium OTA, a solution that lays the foundation for over the air programming (OTAP) for wireless sensor networks and the Internet of Things.
Futurestate IT announced the general availability of its AppRx Application Currency Management (ACM) platform to assess, plan and execute migration of applications for Windows 7 or Server 2008 as well as determine if/how applications can be virtualized.
STMicroelectronics, a leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, announced a multi-sensor module with five degrees of freedom.
The Agilent MIPI M-PHY test suite helps design engineers turn on, debug and validate all layers of their M-PHY devices, including physical and protocol layers, at speeds up to 5.8 Gb/sec.
Avago Technologies announced a series of high-power switch low-noise amplifier (LNA) modules for use in front-end receiver designs of TD-SCDMA and TD-LTE base transceiver station (BTS) applications.
Microchip Expands MiWi Wireless Development Environment for IEEE 802.15.4 2.4 GHz and Unlicensed Sub-GHz NetworksJune 2, 2011 11:33 am | Microchip Technology Inc. | Product Releases | Comments
Microchip Technology Inc. announced its expanded MiWi Development Environment (DE), which is a complete ecosystem for designing star and mesh wireless networking products. The MiWi DE is comprised of
Agilent Technologies announced a range of cutting-edge capabilities that enable economical testing and evaluation of advanced radar and electronic-warfare (EW) systems.
AT4 wireless is introducing the TD-LTE function set into the S3110B LTE Mobile Test Application, and supporting all currently defined TDD frequency bands and bandwidths.
Picochip has been chosen to supply the technology for the second wave of femtocell access points from Contela, used by Korea’s SK Telecom (SKT) for data offload.
RF Micro Devices announced it has extended its portfolio of broadband components to include two new low power IQ Modulators featuring integrated fractional-N synthesizers and voltage controlled oscillators (VCO).
Plessey Semiconductors announced that it will be demonstrating its Electric Potential Integrated Circuit (EPIC) sensor technology at Sensors Expo (Chicago, USA June 6-8 2011). The EPIC sensor is a completely new area of sensor technology that measures changes in an electric field in a similar way to a magnetometer detecting changes in a magnetic fiel
Silicon Laboratories introduced a wireless sensor node solution powered by a solar energy harvesting source. The new turnkey energy harvesting reference design enables developers to implement
Pulse Electronics introduces a new adaptive antenna concept that can be adapted for integration into devices that use an expanding spectrum of operating frequencies to enable faster data transmission rates
Avago announced a complete RF front-end module (FEM) for WiMAX radios in mobile handset or portable PC applications. The AFEM-S257 module is designed for coexistence operation of WiMAX with other cellular and WiFi radios in the same device. The module features