Dontech, Inc. has developed IMO-bond, a proprietary process of applying rigid optical filters (e.g., contrast enhancing, EMI/RFI shielding, or Therma Klear transparent heaters) to electronic displays via a refractive index matched optical (IMO) bonding process. IMO-bond includes
Scintera Networks announced the availability of the SC1869 and SC1889 second generation system-on-chip (SoC) adaptive RF Power Amplifier Linearizers (RFPAL) to address 3G and 4G heterogeneous network deployments. The SC1869/89 are said to
The W3H0830F hybrid coupler is designed for broad bandwidth applications from 800 to 3000MHz. This LTCC coupler is surface mountable and handles up to 100W of RF power yet has a
Representatives from Rogers Corporation’s Advanced Circuit Materials Division (ACMD) will be on hand at the upcoming 2011 IEEE International Microwave Symposium (IMS) to share insights on the optimum use of the company’s high-performance circuit materials, including its RT/duroid 6035HTC, and RO4360, laminates.
TriQuint Semiconductor and Agilent Technologies Inc. announced results for building next-generation RF solutions. This includes enhanced TriQuint process design kits with support for Agilent’s Advanced Design System 2011 EDA software and the development of an ADS RF Module PDK for TriQuint’s RFIC/MMIC and RF Module integrated design flow. The upgraded
Many have asked the question, “How can we fill the need for rural broadband Internet access in our rural community?” But few have actually ventured beyond the question to attempt to make it happen.
Hittite Microwave announces the release of a new ultra-low phase noise synthesizer IC. The HMC704LP4E has been designed for best phase noise and lowest spurious content possible in an integrated synthesizer.
The R&S ZNB and R&S ZNC from Rohde & Schwarz inaugurate a new generation of vector network analyzers, with a dynamic range up to 140 dB and a sweep time of 4 ms with 401 points and excellent stability.
Stantum, a leading developer of multi-touch technology, announced today that its patented Interpolated Voltage Sensing Matrix (IVSM) technology now supports Google's Android operating system.
TriQuint Semiconductor and Agilent Technologies announced results on their collaboration for building next-generation RF solutions. This includes enhanced TriQuint process design kits with support for Agilent’s Advanced Design System 2011 EDA software and the development of an ADS RF Module PDK for TriQuint’s RFIC/MMIC and RF Module integrated design flow.
Teseq has introduced the new ITS 6006 (Immunity Test System) for radiated EMC emissions testing over an extended 80 MHz to 6 GHz frequency range in a wide variety of EMC applications.
M Series keypads from EAO Switch provide security and access control in public and harsh environments, including heavy-duty and specialty vehicle applications, public kiosks, and vending machines. The M Series modular design and rugged construction make it an ideal solution for fast configuration and customization in any outdoor application.
The new 1.4-micron backside illumination pixel in the OmniVision OV5690 image sensor allows for a full five megapixels in a ¼-inch optical format, and combines best-in-class image quality with a 20 percent reduction in camera module height.
The Fujipoly Zebra Gold 8000C Series interconnect device is constructed from a low durometer silicone core that is covered with 166 parallel rows of flat, gold-plated wires per inch.
To help protect valuable electronic equipment from damage, ERICO has developed rugged, weatherproof hybrid surge protectors that can handle at least 20,000 amperes of lightning-induced current.
Endwave, a leading provider of high-frequency RF devices and integrated subsystems, has added a pair of integrated frequency upconverters to its line of high-performance GaAs MMIC products.
The Model 1189 from Empower RF Systems is a recent addition to the company’s portfolio of building block designs incorporating the latest GaN device technologies and control functionality.
Analog Devices introduced a 16-bit D/A converter for wired and wireless communication systems that features the industry’s best combination of package size, speed and low noise.
The newest TCXO family for Tellurian Technologies, Inc. the TT-VT2500 meets the need of a stable frequency source at 100 MHz and 200 MHz.
The W3H0830F hybrid coupler is designed for broad bandwidth applications from 800 MHz to 3000 MHz.
Premier Farnell announced a global franchise distribution agreement with Johanson Technology and Johanson Dielectrics, a leading specialist in the design and supply of ceramic solutions and a comprehensive range of RF specific applications.
In this episode, we talk with Manish Gupta of Symmetricom about SyncWorld, a program with industry leaders including Cisco, Alcatel-Lucent and NSN to support precise timing and synchronization requirements for 4G/LTE deployments.
One of the biggest advantages of using RFID in industry and logistics today is the visibility it can provide into the process. With the use of cloud computing, that visibility can be achieved with greater flexibility and lower cost.
High-power radio-frequency devices such as medical scanners and plasma generators will offer improved uptime for owners, as well as increased performance and lower costs, by using the latest generation of high-frequency power transistors introduced by STMicroelectronics...
Gowanda Electronics, a designer and manufacturer of precision electronic components for RF and power applications, is launching its inaugural line of Ultra-Broadband Conical Inductors at the MTT-S International Microwave Symposium.