Whether is it texting during dinner, talking on a cellphone in a public restroom or using a laptop while driving, most people think mobile etiquette is getting worse, not better. Ninety one percent of U.S. adults questioned in a new poll by computer innovation company Intel said they have seen people misuse technology...
Subscribers on contract-based cell phone plans hung up on T-Mobile USA in record numbers in the fourth quarter, as it continues to lose the battle against larger carriers. T-Mobile, the fourth-largest wireless carrier in the U.S., on Friday said it lost 318,000 subscribers...
National Semiconductor announced what it asserts is the industry’s first stereo analog subsystem with integrated Class G headphone amplifier and automatic level control (ALC) for smartphones and feature phones. The PowerWise LM49251’s Class G headphone amp dynamically
Crystek has introduced the LL335 Series Cable Assemblies, a new addition to their line of Low-Loss RF Coaxial Cables. Designed to operate up to 18GHz, the CCSMA-MM-LL335 Cable Assemblies boast extremely low loss, with attenuation ratings of 0.03 dB/ft at 500 MHz, and 0.20 dB/ft at 18GHz.
In this episode of the Tinker's Toolbox we talk to Jim Nohrden of Black Sand about their 3G CMOS RF power amplifier (PA) products. The devices promise to significantly improve the reliability and data throughput of mobile products, and are designed as a drop-in replacement for existing 3G GaAs RF PAs.
National Instruments introduced the NI PXIe-5665, a 3.6 GHz RF vector signal analyzer (VSA) that delivers desirable RF performance in a PXI form factor. The VSA features
In this episode of the Tinker's Toolbox we talk to Jeff Miles, the Director of Mobile Transactions at NXP about their work in the Near Field Communications space and their collaborative efforts with product manufacturers to integrate that functionality into their devices.
Analog Devices, Inc. announced today the release of a new high-performance integrated RF demodulator. The ADRF6801 RF demodulator performs multiple common RF functions in a single package while delivering the performance needed to support high dynamic range receivers...
STMicroelectronics (NYSE: STM), one of the world's largest semiconductor manufacturers and the world's leading supplier of MEMS sensors for consumer and portable applications(1), and bTendo Ltd. announced today that they have signed a development and license agreement to jointly develop the world's smallest Pico Projector for smart phones and other portable consumer-electronics devices. The solution is based on bTendo's innovative Scanning Laser Projection engine technology and ST's leading MEMS (Micro-Electro Mechanical Systems) expertise, video processing know-how and semiconductor process technology.
AirWalk Communications Inc., the leader in innovative small cell radio access networks, Mindspeed Technologies, Inc.(NASDAQ: MSPD), a leading supplier of semiconductor solutions for network infrastructure applications; and Lime Microsystems, a semiconductor company specializing in digitally configurable transceivers
KOA Speer Electronics announced the release of a new metal foil technology in chip type current sense resistors that improves corrosion resistance and its ability to withstand higher temperatures. The TLRH series resistor has a
In this episode of the Tinker's Toolbox we talk to David Sperling of Smith Micro about their new QuickLink Hotspot Manager powered by SODA 1.0.
AVX Corporation has developed what it claims is the industry's smallest multilayer ceramic capacitor (MLCC). Designated as the 0101 Series, the miniature MLCC was designed with well-established technologies to
Central Semiconductor Corp. introduced its CMLDM7484 dual complementary N-channel and P-channel MOSFETs in the SOT-563 package. This device consists of two complementary isolated 30-V, 450-mA MOSFETs that offer desirable energy efficiency. The device
Pelican Imaging Corporation announced that it has developed the first prototype array camera for mobile devices. In addition, the company has announced its Technical Advisory Board that is comprised of three leading experts in computational imaging. The members are
Alcatel-Lucent announced lightRadio, a breakthrough in mobile and broadband infrastructure that streamlines and radically simplifies mobile networks.
In a similar vein of the brouhaha in the news about Taco Bell's meat product, Intel's new WiDi-2 Intel Wireless Display seems to be a case of taking some liberties with the technologies' naming
Researchers have now demonstrated the conformal printing of electrically small antennas on spherical shapes with a radiation quality factor (or Q) that very closely approaches the fundamental limit dictated by physics.
Microchip Technology announced the Microchip Bluetooth Evaluation Kit, which includes CandleDragon, Inc.’s dotstack demonstration Bluetooth Stack.
National Semiconductor announced three multi-channel PowerWise 10 Gbps repeaters provide an equalization gain of 36 dB and consumes half the power (55 mW/channel) with twice the reach (20 meters over 24-AWG cable) of current solutions.
Movidius today announces that it will be demonstrating the world’s most advanced mobile 3D technology at the Mobile World Congress (MWC), Barcelona, 14-17 February 2011. Movidius, producer of the world’s most advanced 3D coprocessors and the first company in the world to produce a full HD 3D platform for mobiles...
M/A-COM Technology Solutions Inc. introduced the MAAM-009560, an HBT driver amplifier for cellular and WiMAX infrastructure applications. This driver amplifier covers a broad frequency range of
Hittite Microwave has introduced a GaAs pHEMT MMIC Power Amplifier for test instrumentation, microwave radio, and military and space applications from DC to 40 GHz. The HMC930 is a GaAs pHEMT MMIC Distributed Power Amplifier die that