RF Micro Devices, a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today unveiled the highly integrated RF6555 ZigBee front end module (FEM).
LCR Electronics now offers two new series of EMI Filters for MRI shielded rooms. The 058 series filters are designed to mitigate any unwanted EMI noise through MRI room telephone, alarm and data lines. The UL-recognized 059 series filters provide EMI suppression along the main power lines.
Skyworks Solutions introduced connectorized, high power filters for military, homeland security, airborne and high-end commercial transceiver applications.
Microlab has launched a new product line of Low Cost Injector-Diplexer Combiners: BK-51. These ‘Tuned-by-Design’ components are able to separate or combine the new LTE-2600 / WiMAX-2600 bands that operate in a frequency range of 2400 MHZ to 2690 MHz and LTE-700 or GSM-850 / 900 bands, covering the frequency range of 698-to 960 MHz.
Endwave Corporation has added a pair of integrated frequency upconverters to its line of high-performance GaAs monolithic-microwave-integrated-circuit (MMIC) products.
Expanding on the popularity of the packaged version, the TGA2533 provides over 2W P1dB from 12.7 to 15.4 GHz in a DIE format.
Neul announced the launch of NeulNET, presented as the first production wireless radio system designed to use the white space spectrum.
In the last few years, Communication technology by Near Field Communications (NFC) has experienced a lot of improvements. New Iphone5 has been announced with this NFC functionality for E-Wallet application.
Texas Instruments introduced the second device in the family of PurePath Wireless audio products for consumer, portable and high-end audio applications.
Ultra low power (ULP) RF specialist Nordic Semiconductor announced that Dayton Industrial has announced what the world's first production-ready Bluetooth low energy heart-rate chest belt that is ready to go into volume production.
Qualcomm Atheros announced the AR9004TB, the industry’s first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.4 GHz and 5 GHz band Wi-Fi.
Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with a single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices
The AMA Association for Sensor Technology presents this year’s 10,000-euro SENSOR Innovation Award on the 7th of June equally to two contenders...
The new BU21023/BU21024 Series of high-speed, high noise immunity, low-voltage resistive touchscreen controllers are now available from ROHM Semiconductor. These new controllers are
Skyworks Solutions introduced the first in a series of ultra low current, general purpose low noise amplifiers (LNAs) for diverse wireless applications including Bluetooth headsets, hearing aids, meter reading devices, and 2.4 GHz wireless applications.
LPKF, a leading manufacturer of laser and electronic systems, will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium
Cree Demonstrates Industry's First C-Band GaN HEMT MMIC High-Power Amplifier for Satellite CommunicationsJune 7, 2011 3:31 pm | Product Releases | Comments
Cree will demonstrate the industry's first GaN HEMT MMIC high power amplifier (HPA) for satellite communication applications during the 2011 IEEE International Microwave Symposium held June 7-9 in Baltimore
Agilent Technologies introduced the newest member of its popular ENA Series of network analyzers, the E5072A vector network analyzer.
The Vectron MD-023 EHXO is specifically designed to ensure accurate timing in wireless base stations, and will be showcased in Booth 1002 at the IMS 2011 Symposium in Baltimore, MD from June 7-9th 2011.
The IEEE Symposium on New Frontiers in Dynamic Spectrum Access Networks (DySPAN 2011), the leading international conference dedicated to the advance of cutting-edge wireless technologies, recently celebrated its 5th annual event in Aachen, Germany.
Libelium, a technology leader in wireless sensor networks, announces the launch of Libelium OTA, a solution that lays the foundation for over the air programming (OTAP) for wireless sensor networks and the Internet of Things.
Futurestate IT announced the general availability of its AppRx Application Currency Management (ACM) platform to assess, plan and execute migration of applications for Windows 7 or Server 2008 as well as determine if/how applications can be virtualized.
STMicroelectronics, a leading supplier of MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications, announced a multi-sensor module with five degrees of freedom.
The Agilent MIPI M-PHY test suite helps design engineers turn on, debug and validate all layers of their M-PHY devices, including physical and protocol layers, at speeds up to 5.8 Gb/sec.
Avago Technologies announced a series of high-power switch low-noise amplifier (LNA) modules for use in front-end receiver designs of TD-SCDMA and TD-LTE base transceiver station (BTS) applications.