Agilent Technologies announced the first modular AXIe embedded controller – the Agilent M9536A, a powerful one-slot module that can be used to build compact AXIe systems.
Sager Electronics announced its new authorization with General Devices.
Gore has selected Richardson RFPD as the global distributor for its new 18 GHz GORE PHASEFLEX Microwave/RF Test Assemblies.
STMicroelectronics and CMP announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to universities, research labs and companies through the silicon brokerage services provided by CMP.
CYBRA Corporation announced that Maidenform Brands has selected CYBRA as the solution provider for Maidenform’s RFID item-level EPC tagging initiative.
Tecate's Ultracapacitor Cells and Modules Ideal for Automatic Meter Reading and Smart Grid ApplicationsJune 16, 2011 12:02 pm | Product Releases | Comments
Announced today by Tecate Group is the availability of custom and standard ultracapacitor cells and modules specifically engineered for today's Automatic Meter Reading (AMR) and smart grid applications.
StarView Solutions announced that Scott Greeson has joined the company as Vice President of Operations. He will lead the company's corporate strategy and growth initiatives.
Colson Caster Corporation has been granted a new certificate of quality assurance from the International Organization for Standardization (ISO).
Comtech Xicom Technology introduced a new high efficiency 400 Watt Ku-Band traveling wave tube amplifier (TWTA) with the size, weight and prime-power requirements of traditional 200 Watt products.
NXP Semiconductors N.V. announced the launch of a complete line of overmolded plastic (OMP) RF power devices with peak powers ranging from 2.5 to 200 Watts.
Avago Technologies announced a complete RF front-end module (FEM) for WiMAX radios in mobile handset or portable PC applications.
Anaren announced that it has launched a new line of Xinger-brand, subminiature directional couplers measuring only 2 x 1.25 x 0.7 mm (0805 footprint).
This is a video on some of the latest technology from Anadigics at their booth at the 2011 International Microwave Symposium in Baltimore.
Richardson RFPD to Feature Design Engineering Capabilities for Renewable Energy Applications at PCIM Asia 2011June 16, 2011 9:15 am | News | Comments
Richardson RFPD announced today its Energy Management team will be showcasing their engineered assembly capabilities at PCIM Asia 2011, June 21-23 in Shanghai, China.
AVX has developed new dielectric and internal electrode materials for its 0805 multilayer capacitor (MLC) chip. These new materials are optimized for high frequency performance and allow for a significantly lower equivalent series resistance than in previous versions of RF capacitors.
AVX has developed a multilayer capacitor (MLC) chip series with new dielectric and internal electrode materials in a 0402 size.
AVX has expanded its thin-film Accu-P Series capacitors to provide ultra-tight capacitance tolerance versions ideal for antenna matching in cellular handsets.
Rohde & Schwarz has developed a unique method that accurately measures group delay and phase linearity on satellite links. With the new R&S ZVA-K10 software option, users can perform measurements using two network analyzers located at separate sites.
In this episode, we talk to Chief Tyrone "Ty" Morrow of the City of Freeport, Texas on the first stage of the deployment of a WiFi-based municipal surveillance system being installed by ADT with the assistance of Motorola.
Agilent Technologies introduced five new PNA microwave vector network analyzer models, up to 67 GHz. The new PNA Series is based on Agilent’s PNA-X architecture and is the world’s highest performing microwave network analyzer, setting a new price/performance standard in the industry.
Peregrine Semiconductor announced availability of the RoHScompliant PE64904 and PE64905 DuNE Digitally Tunable Capacitors.
Laird Technologies announced it will be attending the Wireless Sensor Networks & Real Time Locating Systems Summit Europe 2011.
IAR Systems and Qualcomm Atheros Collaboration Creates First Wi-Fi System-in-Package Development SystemJune 16, 2011 4:17 am | News | Comments
IAR Systems today announced its collaboration with Qualcomm Atheros on its new AR4100 solution, a highly integrated, Wi-Fi system-in-package for microcontroller based design.
Following in the footsteps of the Aeroflex industry-standard 2030 Series avionics signal generator, Aeroflex Limited, announced the addition of popular avionics waveforms to its S-Series signal generator family.
Allegro MicroSystems announces a new multi-output WLED/RGB driver for backlighting LCD monitors and televisions. The A8516 is a versatile and economical LED driver IC that will enable system designers to reduce component count and overall system cost.