National Instruments Honors Engineering and Science Innovation With 2011 Graphical System Design Achievement AwardsAugust 8, 2011 8:15 am | News | Comments
National Instruments honored 17 innovative applications developed by engineers, scientists and researchers from around the world at the fourth annual Graphical System Design Achievement Awards. At the award ceremony held during the annual NIWeek conference and exhibition...
The International Symposium on Quality Electronic Design (ISQED) is accepting paper, panel and speaker proposals, as well as exhibitor and sponsorship applications, for its 13th annual event.
Imec, Katholieke Universiteit (KU Leuven), CEA-Leti, and the University of Liege will hold the 7th International Conference on Silicon Epitaxy and Heterostructures (ICSI) in Leuven, Belgium, from Monday, August 29th to Thursday, September 1st, 2011.
Next year, NEW:UK (National Electronics Week) will be co-locating with 7 other industry events to create the largest manufacturing event in the UK with over 1,000 exhibiting companies, covering in excess of 37,000 metres of exhibition space.
Health 2.0 Europe, a conference dedicated to how Web 2.0 tools, data and social media are transforming healthcare systems in Europe, announced that its second annual event will take place on October 27-28, 2011 in Berlin, Germany.
With U.S. Senator Sheldon Whitehouse providing a video address on manufacturing’s key role in boosting the American economy, the 2011 International Forum on Design for Manufacture and Assembly (DFMA) in Warwick, R.I., quickly established that early product design strategies are the new business model for competitive companies.
The Consumer Electronics Association (CEA) today announced that registration is open for the 2012 International CES, the world’s largest consumer technology tradeshow, scheduled January 10-13, 2012 in Las Vegas, Nevada.
InCheck Technologies’ low-power, lightweight MEMS accelerometers are based on Analog Devices’ ADXL001 chip and feature MEMS accuracy and temperature stability with no field calibration required. Two sensors in one, these accelerometers with
Bill Hutchings of Microchip Technology talks about the company’s new 60 MIPS 16-bit dsPIC Digital Signal Controllers (DSCs) and PIC24 microcontrollers (MCUs).
Bill Hutchings of Microchip Technology discusses the company's latest offering of 16-bit PIC microcontrollers (MCUs) and dsPIC Digital Signal Controllers (DSCs) that bring advanced control to cost-sensitive general-purpose and motor-control designs.
LPRS is using their appearance at the UK Wireless Fortronic Forum to demonstrate the IQRF range of simple to implement, reliable wireless networks for smart metering, home and building automation, intelligent street lighting and environmental monitoring.
Tyler Smith of Microchip Technology talks with ECN about the company's expanded MiWi Wireless Development Environment for IEEE 802.15.4 2.4 GHz and Unlicensed sub-GHz networks.
AWR announced that the event agendas have been finalized and the registration is now open for its Asia Pacific 2011 AWR Design Forum (ADF).
Picochip and InterDigital Demonstrate Converged Gateway With Integrated 3G Femtocell and Wi-Fi at Femtocells World Summit 2011June 27, 2011 7:28 am | News | Comments
Picochip and InterDigital are collaborating on delivering advanced broadband traffic management solutions across cellular femtocells with embedded Wi-Fi access.
Sensors Expo returned to Rosemont Illinois in June and the mood inside the convention center was noticeably more optimistic than last year. Outside, the town was in the grip of a heat wave; but inside it was the technology itself that literally raised both the excitement level and the level of performance for new designs which made things seem, well, hotter. Here are just some of the highlights
ETH Zurich, Atomic Force F&E GmbH and Asylum Research announce the third Euro AFM Forum 2011 to be held in Zurich, Switzerland on September 7 to 9 in cooperation with Prof. Ralph Spolenak at the campus Science City (Hönggerberg) of the Swiss Federal Institute of Technology Zurich (ETH Zürich).
The joint sponsors of the Applied Power Electronics Conference have announced the continuation of the popular $1,000 Student Attendance Awards to cover part of the travel and conference expenses for up to 30 students to attend APEC 2012 in Orlando, Florida, February 5-9, 2012.
Laird Technologies announced it will be attending the Wireless Sensor Networks & Real Time Locating Systems Summit Europe 2011.
The near-term viability of the Japanese manufacturing infrastructure has been shrouded by a lack of information, bureaucracy and factors such as limited power output. JPCA was the first occasion for many observers to observe and report on industry conditions with a wide range of first person input.
Bob Scannell of Analog Devices shows off the ADIS16407 iSensor IMU (inertial measurement unit) which integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis magnetometer and a pressure sensor into a single package.
At Sensors Expo 2011, Raymond Chow of Seiko Epson Corporation demonstrated the company's low profile S4E5A0A0 inertial measurement unit (IMU), which consumes just 30 mA when operating at 3.3 V.
At Sensors Expo 2011, Vijendra Kuroodi, principal systems architect at ROHM Semiconductor, demonstrates the company's new BU21023/BU21024 Series of high-speed, high noise immunity, low voltage resistive touchscreen controllers.
Rohde & Schwarz’ RTO Series features a real time digital trigger that uses a common signal path for both the trigger and acquired data. This eliminates time and amplitude offset between the trigger and signal, enabling signals to be displayed
Omron Electronic Components LLC announced a new Differential pressure type mass flow sensor. It uses the company’s mass flow MEMS Chip, and will have the same external structure as the D6F-P0010A1. The internal flow path has
Analog Devices released the ADIS16407 iSensor IMU (inertial measurement unit) which integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis magnetometer and a pressure sensor into a single package. Each sensor in the unit combines