VIA Technologies, Inc. announced the VIA EPIA-M850 Mini-ITX board for suit HD-intensive, commercial multimedia-centric devices. Measuring 17 cm x 17 cm, this Mini-ITX board features the VIA Nano E-Series processor, available in both 1.3+GHz (clocked at 1.6 GHz) and fanless 1.2 GHz SKUs. The VIA Nano E-series is
Tektronix announced the TLA6000 Series, a logic analyzer that brings high-end debug and analysis to mainstream embedded systems designers. Higher signal speeds and increased board densities often lead to signal integrity issues such as crosstalk, ground bounce, and ringing that manifest themselves in functional failures of the digital system. The logic analyzer is asserted to
National Semiconductor unveiled what is presented as the industry’s first eight-channel ultrasound transmit/receive chipset for portable ultrasound systems.
Devoted to the development of new radiation detector and systems technology, RMD Instruments Corp. announces that its innovative LeadTracer-RoHS XRF system now can be used in solar applications to ensure RoHS compliance.
One area of production safety testing that TDK-Lambda routinely gets inquiries on is the dielectric withstand test, sometimes known the as dielectric strength test or “hi-pot” test. Hi-pot testing, derived from “high potential”, ensures that good isolation exists between parts of the system.
What will be the most important driver for the power electronics industry in the next few years: Architectures? Topologies? Materials? Applications? This is a hotly debated question that has no clear answers...
Central Semiconductor Corp. announces the introduction of the CMRD6263DO dual isolated 70V, 15mA Schottky diodes packaged in the ultra miniature SOT-963 surface mount case. This device has an outstanding low VF of 395mV and a fast switching speed of less than 5.0ns...
Although it is tempting to portray technology discussions as “battles” with a winner and loser, more often they will co-exist with technologies serving different needs at different times.
Texas Instruments announced the availability of TMS320C5504 and TMS320C5505 ultra-low-power digital signal processors (DSPs) at 150 MHz, providing 25 percent higher performance than previous C55x devices. The processors are
Intervox, a division of International Components Corporation (ICC), has introduced a low profile speaker, Model S150RMSS-50-HT3, capable of delivering multiple tones, as well as, voice alert messages.
Crystek's CVCO55CC-2122-2242 VCO (Voltage Controlled Oscillator) operates from 2122 MHz to 2242 MHz with a control voltage range of 0.5V~4.5V. This VCO features a typical phase noise of -105 dBc/Hz @ 10KHz offset and has excellent linearity.
Multi-Seals Inc. introduces Wash-Away dissolvable spacers, designed to provide consistent spacing between printed circuit boards and PCB components. These organic polymer spacers locate PCB components during soldering operations.
This month's question is, “What barriers still exist between solid-state lighting and mainstream acceptance in the marketplace?”
As solar energy systems evolve, there is a tendency amongst investors and industry pundits to look for “the winning technology” that has the highest efficiency and the lowest production cost. However, winning solutions for solar energy are, in fact, as diverse as the earth’s climates.
The most effective way to mitigate the impact of man’s energy use is to reduce power consumption. The need to reduce active-mode power consumption is obvious. Not so obvious is the need to minimize power drain in standby mode — when products are essentially doing nothing.
Postironic’s PCS series is a popular choice for applications requiring a quick disconnect, high power connector. The PCS three contact variant is now available with screw terminals, allowing field termination with the use of a screw driver. Crimping tools are not required.
This module, provided by Digi-Key and Tripp Lite, explains the need for a UPS and reviews the three types of UPS systems.
Models 2206 and 2207 solid flanged reaction torquemeters from S. Himmelstein offer certified accuracy. Their high stiffness and ability to handle large extraneous loads (thrust and bending) minimizes crosstalk errors.
TEKO have launched the ‘TEKAM’ range of aluminum instrument cases. These modern and robust enclosures have been designed for fast installation of slide-in PCB assemblies. The all aluminum design provides
Airex’ C12 Series 3-phase brushless linear servo motor can also be operated from a brush type servo drive as a single-phase voice coil motor. Features of the new motor include
The Tactilus heat-sink analysis system by Sensor Products Inc. enables engineers to visualize actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, it
One thing I’ve learned over the years in the semiconductor industry is that I really don’t know anything. Or rather, what I think I know is always changing or isn’t quite what I thought it was.
In this video, Microchip Technology Engineer Jim Bartling demos a TDR Application using a PIC Micro w/ CTMU from the 2010 MASTERs Conference in Phoenix, Arizona.
Fujipoly announces the introduction of Sarcon GR-Tac, a highly conformable and durable .25mm thick polyester reinforced thermal interface material. Sarcon 25GR-Tac is easy to install and typically does not require adhesive due to its naturally tacky consistency.
Gowanda Electronics recently introduced two inductor series meeting the military’s Qualified Products List requirements for “Established Reliability”. Gowanda’s ER10M and ER17S thru-hole RF inductor series are approved to MIL-PRF-39010, Level M.