Ultrasound imaging is one of the most important medical imaging methods due to its safety, cost effectiveness, and real-time capability. Conventional ultrasonic imaging systems use frequencies from 2–20 MHz with a resolution of millimeter level.
In this episode, Alix Paultre and Kevin Parmenter discuss the coming year and some of the technical and industry issues that will be influencing it and the design community. From ubiquitous computing to the smart grid, this episode of the Tinker’s Toolbox covers many of the things that will be dominating the news next year. Right-click to download the podcast
The Lifetime Power Energy Harvesting Development Kit for Wireless Sensors enables the development of battery-free wireless sensor nodes and other low-power, untethered devices.
Semtech Corp. today announced the industry’s first smart current sink LED backlighting platform with on-chip digital lighting effects for high-end handheld displays. This new platform incorporates Semtech’s patent-pending, smart Automatic Dropout Prevention (ADP) technology...
The AS540x product family of 3-dimensional Hall encoders from austriamicrosystems provides absolute and highest resolution with angular or linear output data.
The RF3932 highly-efficient 75-watt gallium nitride (GaN) RF unmatched power transistor operates over a broad frequency range (DC to 3GHz) and delivers high peak efficiency of >65%.
SiTime Corporation today introduced the SiT1052, the first MEMS resonator for real time clock and time-keeping applications. The SiT1052 can be cost-effectively integrated inside a plastic package, eliminating all external time-keeping components from an electronic system.
IQD has announced immediate availability of a newly developed high frequency MEMS Oscillator on the opening day of Electronica 2010. The new IQMS-900 series MEMS (Micro Electro Mechanical Systems) oscillator is available in an exceptionally wide frequency range from 1MHz up to 800MHz.
As a technology company dedicated to the development, commercialization, manufacture, and distribution of innovative electronic components, acceptance into DOSA serves to highlight CUI’s commitment in providing competitive power products to a global market.
FCI, a leading developer of connectors and interconnect systems, announced the expansion of its terminal blocks product portfolio with new plug and socket configurations, all ideal for industrial and instrumentation applications.
Google TV may say more about the power of search and Android than it does about a new paradigm for using your HDTV.
With the holidays approaching, what product or technology is on your wish list?
This month's ECN Roundtable question is: “What technology or industry design trend do you feel will impact the power industry the most in the coming year?"
Crystek has introduced a new line of High Pass Filters, the CHPFL Series. Encased in a rugged SMA housing, this filter line is designed for test equipment and general lab use. Five models, with frequency ranges from DC to 100 MHz through 1 GHz...
ZMD AG today announced a cost-effective line driver and level shifter IC with a high-voltage I/O channel that meets the physical layer requirements of sensor and actuator systems used in factory automation applications.
The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package.
One of the most significant developments in the global optoelectronics and display markets over the past few years has been a complete revolution in the value proposition offered by custom technologies.
Maxim demonstrates their smart-grid energy metering system at electronica 2010.
The integration of sensors and actuators into encapsulated multi-chip modules creates formidable challenges to characterizing and controlling process pressure. However, a new measurement method developed by Fraunhofer IZM shows that pressure-indicating sensor film can fully characterize the area pressure distribution on the cavity and on substrate surfaces within a mold cavity during encapsulation.
SOURIAU PA&E has brought High Temperature Co-Fired Ceramic (HTCC) technology to its popular line of Micro-D connectors, providing design engineers with a new connector option that delivers high levels of mechanical performance and superior wire bonding density.
With the principle of a multiple color sensor, MAZeT is pursuing a strategy that bridges the gap between the three-range sensors and spectral measurement devices for sensor applications. The new MMCS6 product family is based on the proven technologies...
Atmel, a leader in microcontroller and touch solutions, announced the new Atmel SAM3N series to expand their ARM Cortex-M3 Flash Family.
Silicon Laboratories introduced what is presented as the most highly integrated car radio tuner IC family, incorporating the entire radio tuner solution from antenna input to audio output in a single CMOS IC.
Power Integrations has launched the HiperPFS family of power factor correction (PFC) controllers with integrated high-voltage power MOSFETs.