Himax Technologies, today unveiled an industry-leading 3D timing controller for naked-eye 3D panels, suitable for handheld applications including tablet PCs, digital photo frames, portable DVD players and gaming devices.
The stated mission of EcoCar is to find new ways to reduce the environmental impact of motor vehicles and prepare future engineering leaders for that task by providing
Rohde & Schwarz’ RTO Series features a real time digital trigger that uses a common signal path for both the trigger and acquired data. This eliminates time and amplitude offset between the trigger and signal, enabling signals to be displayed
Omron Electronic Components LLC announced a new Differential pressure type mass flow sensor. It uses the company’s mass flow MEMS Chip, and will have the same external structure as the D6F-P0010A1. The internal flow path has
Analog Devices released the ADIS16407 iSensor IMU (inertial measurement unit) which integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis magnetometer and a pressure sensor into a single package. Each sensor in the unit combines
This training module, provided by Digi-Key and Qualtek, will give a brief history of the progression of the USB standard, educate the reader about the differences of Half and Full duplex, compare the specifications of USB 2.0 with USB 3.0, and showcase the newest features of USB 3.0.
In the electronics manufacturing industry, when you throw in specialized odd-form components, the manufacturer must decide how to place the component: hand assembly or with their automated equipment.
Texas Instruments introduced the second device in the family of PurePath Wireless audio products for consumer, portable and high-end audio applications.
General Micro Systems, Inc. (GMS) has introduced the S822-D (“Armor”) an ultra-small, rugged computer system that not only offers complete modularity enabling one base system to support multiple needs in one program...
Every year consumers demand more from the products they use and the services provided to them. For the auto industry this means smarter, more fuel efficient cars to compensate for rising fuel costs.
Qualcomm Atheros announced the AR9004TB, the industry’s first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.4 GHz and 5 GHz band Wi-Fi.
Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with a single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices
Nextreme Thermal Solutions introduced the Thermobility Wireless Power Generator WPG-1S evaluation kit with on-board energy storage using the INFINERGY D-MPM101 micro power module from Infinite Power Solutions. The device uses
The new BU21023/BU21024 Series of high-speed, high noise immunity, low-voltage resistive touchscreen controllers are now available from ROHM Semiconductor. These new controllers are
Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems
MicroStrain released SensorCloud, a sensor data storage, visualization and remote management platform that leverages cloud computing technologies to provide desirable data scalability, rapid visualization, and user programmable analysis.
Skyworks Solutions introduced the first in a series of ultra low current, general purpose low noise amplifiers (LNAs) for diverse wireless applications including Bluetooth headsets, hearing aids, meter reading devices, and 2.4 GHz wireless applications.
Seiko Epson Corporation announced the commercial development of a new inertial measurement unit (IMU) named the S4E5A0A0. The new IMU provides stable, accurate measurement capability and among the lowest power consumption and smallest form
LPKF, a leading manufacturer of laser and electronic systems, will exhibit its ProtoMat S63 and ProtoLaser S in Booth #2202 at the upcoming IEEE Microwave Theory & Techniques Society (MTT-S) International Microwave Symposium
Cree Demonstrates Industry's First C-Band GaN HEMT MMIC High-Power Amplifier for Satellite CommunicationsJune 7, 2011 3:31 pm | Product Releases | Comments
Cree will demonstrate the industry's first GaN HEMT MMIC high power amplifier (HPA) for satellite communication applications during the 2011 IEEE International Microwave Symposium held June 7-9 in Baltimore
Agilent Technologies introduced the newest member of its popular ENA Series of network analyzers, the E5072A vector network analyzer.
The Vectron MD-023 EHXO is specifically designed to ensure accurate timing in wireless base stations, and will be showcased in Booth 1002 at the IMS 2011 Symposium in Baltimore, MD from June 7-9th 2011.
Murata Power Solutions today announced three new series of surface mount inductors aimed at high current applications where low loss characteristics are essential.
The IEEE Symposium on New Frontiers in Dynamic Spectrum Access Networks (DySPAN 2011), the leading international conference dedicated to the advance of cutting-edge wireless technologies, recently celebrated its 5th annual event in Aachen, Germany.
Avnet announced the launch of a global series of SpeedWay Design Workshops featuring the recently released, low-cost Xilinx Spartan-6 FPGA LX9 MicroBoard.