Will unmanned drones ever replace manned fighter jets?
International Rectifier introduced a family of HEXFET power MOSFETs featuring ultra-low on-state resistance (RDS(on)) in an industry-standard SOT-23 package.
Maury Microwave announced the introduction of an entirely new line of instrument-grade precision components designed to provide users with the right level of performance at the right price. This new product line, TactiCal by Maury, includes calibration standards manufactured to the same high quality and exacting requirements...
Dytran Instruments has recently expanded their line of miniature in-line charge amplifiers. The 4705M series represents a family of four charge amplifiers, with fixed sensitivities between 0.5 and 50 mV/pC. They feature 10-32 input jacks and BNC output jacks.
Many of Empower’s standard modules can be adapted to be installed into an “All environment” rated enclosure. Options that have been integrated into our harsh environment, systems enclosure include...
Digital power addresses many of the challenges that analog power systems face today, but there are some significant barriers to switching over.
Texas Instruments Incorporated introduced the 12-bit ADS7924 successive approximation (SAR) analog-to-digital converter (ADC). Through intelligent system power management features, the 2.2-V ADS7924 works with any low-power system requiring sensor monitoring to potentially lower power across the system by more than 50 percent.
Before becoming engrossed in the topic of this episode, there were some rather interesting recent occurrences associated with the last episode, “Energy 103 – Wind Turbines II”, which alluded to my theory that tornados which occur in ‘Tornado Alley’ in the Midwestern US...
California Eastern Laboratories (CEL) is now shipping its new NE3517S03 GaAs Field Effect Transistor (FET). The new FET has been redesigned with an ultra low cost plastic package, driving down costs to enable even the lowest cost product designs.
Skyworks Solutions announced that Samsung Electronics is leveraging one of its power amplifier (PA) modules for the GT-B3710 – a high speed fourth generation (4G) USB modem that is the world’s first long-term evolution (LTE)-commercialized device.
Wolfson Microelectronics has today announced the introduction of its latest analog-to-digital converters (ADCs), the WM8788 and WM8789, both of which deliver world-class audio to leading home entertainment applications.
The MDX is a high reliability D-Subminiature connector with size 20 fixed contacts and is available with 9, 15, 25, 37, and 50 contacts. The MDX series utilizes the unique new PosiBand contact system.
UltraTek, a technology research company, is pleased to announce their new Flipper USB products which are available to computer users. Flipper USB has many advantages over the traditional non-flip-able USB devices. Flipper USB is user-friendly and safe. With Flipper USB, it fits into the computer port either way.
The DC1503A evaluation kit from Newark supports Linear Technology's LTM2881 and the DC1554A supports the LTM2882. Both boards are available in either 3.3V or 5V.
Fairchild Semiconductor’s FPF1038 / FPF1039 advanced load management switches reduce in-rush current, or high di/dt, when a switch is used to disconnect loads with high (>100µF) output capacitances.
To serve the steady migration from cold cathode florescent (CCFL) backlighting of LCD displays to LED backlights, TDK-Lambda has launched their new ALD Series of multi-output dc-dc backlight LED drivers. These drivers are specifically designed for LED backlighting of LCD displays that are now used in industrial and consumer applications.
Seiko Instruments has developed the S-1142 Series high-withstand voltage CMOS process positive voltage regulator that has a low current consumption and a high output voltage accuracy. Operating at a high maximum voltage of 50V and a low current consumption of 4.0µA (Typ.)...
Organizing your test strategy around a common test platform is a proven technique for reducing capital cost, increasing reuse, and lowering the operational overhead...
The Heise DXD digital pressure transducer delivers the benefits of digital communication at a bargain price. This versatile instrument is now available with a LabVIEW driver and a powerful new LabVIEW based utility software that allows the user to address, configure and monitor one or more DXDs.
Blizzard Entertainment has narrowly avoided a public relations nightmare: an unfavorable comparison with Communist China. The game publisher recently announced plans (then shelved them) to require real names (“Real ID”) on its forums. Meanwhile, China has vowed “to reduce anonymity” on the internet.
Intertronics introduces light-curable maskant for surface protection during harsh environment processing.July 13, 2010 10:34 am | Product Releases | Comments
SpeedMask® 730-BT from Intertronics is a DYMAX masking resin, formulated to provide excellent surface protection during chemical milling/etching, plating, anodizing, and aggressive grit-blasting operations, thus aiding in the manufacturing, overhaul, repair and rework of turbine engine blades, vanes and other turbine components, as well as many other metal finishing applications.
Algotronix Ltd., Edinburgh, UK announces the availability of an XTS-AES core to meet the NIST SP800-38E recommendation published in January 2010 and the IEEE 1619-2007 standard.
LynxOS-SE time- and space-partitioned secure RTOS for ARM Cortex-A8 processor enables power efficient, high-performance real-time mission-critical systems.
Imec sets major step towards 20nm half pitch interconnects with the realization of electrically functional copper lines embedded into silicon oxide using a spacer-defined double patterning approach.
Imec demonstrates the value of its SiGe above-IC MEMS technology platform for improving performance of state-of-the-art MEMS with the development of new MEMS devices. The new devices are a 15µm SiGe micromirror and a grating light valve for high-resolution displays. The devices were realized with imec’s generic CMOS-compatible MEMS process for the monolithic integration of MEMS devices directly on top of CMOS metallization.