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CHiL Semiconductor Expands Worldwide

November 30, 2010 8:32 am | by Larry Spaziani, CHiL Semiconductor (www.chilsemi.com) | Blogs | Comments

We're proud to announce that CHiL Semiconductor is expanding its worldwide sales and support channels by opening sales offices in Japan and in Europe. High electricity costs have made CHiL’s energy efficient solutions, which result in increased efficiency across the entire load line, particularly attractive in these markets.

Link software migrates test vectors to Agilent In-Circuit Testers

November 30, 2010 4:32 am | Agilent Technologies | Product Releases | Comments

GOEPEL electronic introduces a special link software to migrate test vectors to Agilent In-Circuit Testers (ICT). The vector link was developed in cooperation with the GATE Program member WG-Test and supports the transfer of hybrid Boundary Scan test sets...

Ultra-miniature 2.5 x 3.2 mm TCXO’s

November 30, 2010 4:28 am | Product Releases | Comments

ILSI expands its TCXO offering with the release of the I537/I538 series. The I537/I538 series is an ultra-miniature 2.5 x 3.2 mm TCXO available in stabilities to ±0.5 ppm. Standard supply voltages include 2.7V, 3.0V and 3.3V. Available outputs are HCMOS...

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Energy 110: Fuel Cells

November 30, 2010 3:54 am | by Prof. Ken Johnson | Blogs | Comments

This episode will continue looking at various so-called “green” energy sources with regard to how ‘green’ they are, the state of their technology, and possible economic impact on their users as well as on the non-user taxpayers.

The uCalc Credit Card Scientific Calculator-Computer

November 30, 2010 3:21 am | Videos | Comments

Dave of the EEVblog describes the design of his open source hardware uCalc credit card sized calculator / computer.

Power supplies accept wide AC input range

November 29, 2010 11:13 am | TDK-Lambda Americas, Inc. | Product Releases | Comments

TDK-Lambda has unveiled its latest addition to its ZWS line of compact AC-DC pcb-mountable power supplies. The new single-output ZWS-BAF series are 100 and150-watt supplies that accept a very wide AC input range, have a low profile of 1.3 to 1.45”...

Semiconductor Technologies Accelerate Development of Ultrasound Specific Integrated Circuits

November 29, 2010 10:47 am | by Xiaochen Xu and Harish Venkataraman, Medical Business Unit, Texas Instruments | Articles | Comments

Ultrasound imaging is one of the most important medical imaging methods due to its safety, cost effectiveness, and real-time capability. Conventional ultrasonic imaging systems use frequencies from 2–20 MHz with a resolution of millimeter level.

Tinker's Toolbox - The New Year

November 29, 2010 9:53 am | Podcasts | Comments

In this episode, Alix Paultre and Kevin Parmenter discuss the coming year and some of the technical and industry issues that will be influencing it and the design community. From ubiquitous computing to the smart grid, this episode of the Tinker’s Toolbox covers many of the things that will be dominating the news next year. Right-click to download the podcast

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Development Kit Explores RF Energy Harvesting

November 29, 2010 9:30 am | Product Releases | Comments

The Lifetime Power Energy Harvesting Development Kit for Wireless Sensors enables the development of battery-free wireless sensor nodes and other low-power, untethered devices.

LED backlighting platform designed with on-chip digital lighting effects

November 29, 2010 9:01 am | Product Releases | Comments

Semtech Corp. today announced the industry’s first smart current sink LED backlighting platform with on-chip digital lighting effects for high-end handheld displays. This new platform incorporates Semtech’s patent-pending, smart Automatic Dropout Prevention (ADP) technology...

Hall Sensor Provides True 3-axis Differential Measurement

November 29, 2010 8:53 am | Product Releases | Comments

The AS540x product family of 3-dimensional Hall encoders from austriamicrosystems provides absolute and highest resolution with angular or linear output data.

GaN RF Unmatched Power Transistor Boasts Improved Performance

November 29, 2010 8:32 am | Product Releases | Comments

The RF3932 highly-efficient 75-watt gallium nitride (GaN) RF unmatched power transistor operates over a broad frequency range (DC to 3GHz) and delivers high peak efficiency of >65%.

World’s First MEMS Resonator for Real Time Clock

November 29, 2010 8:21 am | Product Releases | Comments

SiTime Corporation today introduced the SiT1052, the first MEMS resonator for real time clock and time-keeping applications. The SiT1052 can be cost-effectively integrated inside a plastic package, eliminating all external time-keeping components from an electronic system.

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MEMS oscillator reduces lead-time across 1MHz to 800MHz frequency range

November 29, 2010 7:21 am | Product Releases | Comments

IQD has announced immediate availability of a newly developed high frequency MEMS Oscillator on the opening day of Electronica 2010. The new IQMS-900 series MEMS (Micro Electro Mechanical Systems) oscillator is available in an exceptionally wide frequency range from 1MHz up to 800MHz.

Joining DOSA

November 29, 2010 6:55 am | by Matt McKenzie, CUI (www.cui.com | Blogs | Comments

As a technology company dedicated to the development, commercialization, manufacture, and distribution of innovative electronic components, acceptance into DOSA serves to highlight CUI’s commitment in providing competitive power products to a global market. 

Terminal Blocks Target Industrial and Instrumentation Apps

November 29, 2010 6:49 am | Product Releases | Comments

FCI, a leading developer of connectors and interconnect systems, announced the expansion of its terminal blocks product portfolio with new plug and socket configurations, all ideal for industrial and instrumentation applications.

Google TV for the Rest of Us

November 29, 2010 5:55 am | by by Eric Broockman, Alereon (www.alereon.com) | Blogs | Comments

Google TV may say more about the power of search and Android than it does about a new paradigm for using your HDTV.

Brainstorm: Holiday Wish List

November 29, 2010 4:32 am | by Edited by Jason Lomberg, Technical Editor | Articles | Comments

With the holidays approaching, what product or technology is on your wish list?

The ECN Roundtable - Power Predictions for 2011

November 24, 2010 5:03 am | Articles | Comments

This month's ECN Roundtable question is: “What technology or industry design trend do you feel will impact the power industry the most in the coming year?"

High Pass Filters designed for test equipment and general lab use

November 23, 2010 9:24 am | Product Releases | Comments

Crystek has introduced a new line of High Pass Filters, the CHPFL Series. Encased in a rugged SMA housing, this filter line is designed for test equipment and general lab use. Five models, with frequency ranges from DC to 100 MHz through 1 GHz...

Line driver intended for factory automation applications

November 23, 2010 8:07 am | Product Releases | Comments

ZMD AG today announced a cost-effective line driver and level shifter IC with a high-voltage I/O channel that meets the physical layer requirements of sensor and actuator systems used in factory automation applications.

MOSFET Packaging Enables High Power Density in DC-DC Designs

November 23, 2010 7:48 am | Fairchild Semiconductor | Product Releases | Comments

The Dual Cool package is a top-side cooling PQFN device that incorporates new packaging technology which enables additional power dissipation through the top of the package.

Benefits of Custom LED & LCD Technology

November 23, 2010 6:45 am | by Jeff Oliveros, Director OEM Products, Lumex | Articles | Comments

One of the most significant developments in the global optoelectronics and display markets over the past few years has been a complete revolution in the value proposition offered by custom technologies.

Maxim Smart-Grid Solutions at electronica 2010

November 23, 2010 6:07 am | Videos | Comments

Maxim demonstrates their smart-grid energy metering system at electronica 2010.

Ensuring Reliability: A New Method for Measuring Pressure Distribution During Encapsulation

November 23, 2010 5:45 am | by Dr. Thomas Schreir-Alt, Fraunhofer IZM, www.izm.fraunhofer.de, and Jeffrey G. Stark, Sensor Products Inc.,www.sensorprod.com | Articles | Comments

The integration of sensors and actuators into encapsulated multi-chip modules creates formidable challenges to characterizing and controlling process pressure. However, a new measurement method developed by Fraunhofer IZM shows that pressure-indicating sensor film can fully characterize the area pressure distribution on the cavity and on substrate surfaces within a mold cavity during encapsulation.

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