Karl von Gunten, Director of Marketing at Nextreme Thermal Solutions spends some time with ECN at Sensors Expo 2011 to demonstrate the Thermobility Wireless Power Generator and its evaluation kit with onboard energy storage
At Sensors Expo 2011, Vijendra Kuroodi, principal systems architect at ROHM Semiconductor, demonstrates the company's new BU21023/BU21024 Series of high-speed, high noise immunity, low voltage resistive touchscreen controllers.
In the last few years, Communication technology by Near Field Communications (NFC) has experienced a lot of improvements. New Iphone5 has been announced with this NFC functionality for E-Wallet application.
Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco model 3075M6-XXX hardline cable assembly, offering high-reliability performance to +482°C (+900°F) in support of a variety of high-temperature aerospace...
With active PFC and Efficiency Level V, the PPWAD200 Series from Power Partners provides an industry leading 200 Watts of desktop power in a compact 7.42” x 4.1” x 2.36” package.
Central Semiconductor announces the CFSH01-30L Low VF Schottky diode in the space saving, low profile SOD-882L package.
Haydon Kerk Motion Solutions offers customers the ability to configure and download CAD models of its newest linear actuator product, the SplineRail. CAD download availability includes both motorized and non-motorized SplineRails and offers the flexibility to modify such features such as linear actuator length...
Himax Technologies, today unveiled an industry-leading 3D timing controller for naked-eye 3D panels, suitable for handheld applications including tablet PCs, digital photo frames, portable DVD players and gaming devices.
The stated mission of EcoCar is to find new ways to reduce the environmental impact of motor vehicles and prepare future engineering leaders for that task by providing
Rohde & Schwarz’ RTO Series features a real time digital trigger that uses a common signal path for both the trigger and acquired data. This eliminates time and amplitude offset between the trigger and signal, enabling signals to be displayed
Omron Electronic Components LLC announced a new Differential pressure type mass flow sensor. It uses the company’s mass flow MEMS Chip, and will have the same external structure as the D6F-P0010A1. The internal flow path has
Analog Devices released the ADIS16407 iSensor IMU (inertial measurement unit) which integrates a tri-axis gyroscope, tri-axis accelerometer, tri-axis magnetometer and a pressure sensor into a single package. Each sensor in the unit combines
This training module, provided by Digi-Key and Qualtek, will give a brief history of the progression of the USB standard, educate the reader about the differences of Half and Full duplex, compare the specifications of USB 2.0 with USB 3.0, and showcase the newest features of USB 3.0.
In the electronics manufacturing industry, when you throw in specialized odd-form components, the manufacturer must decide how to place the component: hand assembly or with their automated equipment.
Texas Instruments introduced the second device in the family of PurePath Wireless audio products for consumer, portable and high-end audio applications.
General Micro Systems, Inc. (GMS) has introduced the S822-D (“Armor”) an ultra-small, rugged computer system that not only offers complete modularity enabling one base system to support multiple needs in one program...
Every year consumers demand more from the products they use and the services provided to them. For the auto industry this means smarter, more fuel efficient cars to compensate for rising fuel costs.
Qualcomm Atheros announced the AR9004TB, the industry’s first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.4 GHz and 5 GHz band Wi-Fi.
Texas Instruments is enabling contactless temperature measurement in portable consumer electronics with a single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices
Nextreme Thermal Solutions introduced the Thermobility Wireless Power Generator WPG-1S evaluation kit with on-board energy storage using the INFINERGY D-MPM101 micro power module from Infinite Power Solutions. The device uses
The new BU21023/BU21024 Series of high-speed, high noise immunity, low-voltage resistive touchscreen controllers are now available from ROHM Semiconductor. These new controllers are
Return to Zero is a funny comic strip for engineers, with lab humor, odd situations, and exploding circuits that of course makes a sport out of solving the trickiest of engineering problems
MicroStrain released SensorCloud, a sensor data storage, visualization and remote management platform that leverages cloud computing technologies to provide desirable data scalability, rapid visualization, and user programmable analysis.
Skyworks Solutions introduced the first in a series of ultra low current, general purpose low noise amplifiers (LNAs) for diverse wireless applications including Bluetooth headsets, hearing aids, meter reading devices, and 2.4 GHz wireless applications.
Seiko Epson Corporation announced the commercial development of a new inertial measurement unit (IMU) named the S4E5A0A0. The new IMU provides stable, accurate measurement capability and among the lowest power consumption and smallest form